Inventor · disambiguated record
Se-Chuel Park
Also filed as: PARK SE-CHUEL
8 granted patents·3 pending applications·24 citations·filing 2004–2020
81Inventor score
Top patents by PatentIndex Score
11 records- 0173US7285845B2Lead frame for semiconductor packageSAMSUNG TECHWIN CO LTD·Filed 2005·Granted Oct 23, 2007·10 cites·20 claims
- 0271US8409726B2Printed circuit board with multiple metallic layers and method of manufacturing the sameSHIM CHANG-HAN·Filed 2009·Granted Apr 2, 2013·5 cites·9 claims
- 0370US9171789B2Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frameHAESUNG DS CO LTD·Filed 2013·Granted Oct 27, 2015·3 cites·16 claims
- 0465US7250671B2Lead frame and method for manufacturing semiconductor package with the sameSAMSUNG TECHWIN CO LTD·Filed 2005·Granted Jul 31, 2007·2 cites·9 claims
- 0558US8278564B2Circuit board viaholes and method of manufacturing the sameSHIM CHANG-HAN·Filed 2009·Granted Oct 2, 2012·2 cites·6 claims
- 0656US8937378B2Lead frame and semiconductor package including the samePAEK SUNG-KWAN·Filed 2012·Granted Jan 20, 2015·2 cites·1 claims
- 0751US2012279775A1Circuit board viaholes and method of manufacturing the sameSHIM CHANG-HAN·Filed 2012·Application pending·0 cites
- 0841US2021107094A1Apparatus for and method of polishing surface of substrateHAESUNG DS CO LTD·Filed 2020·Application pending·0 cites
- 0939US2006237824A1Lead frame for semiconductor package and method of manufacturing the sameSAMSUNG TECHWIN CO LTD·Filed 2005·Application pending·0 cites
- 1037US7268021B2Lead frame and method of manufacturing the sameSAMSUNG TECHWIN CO LTD·Filed 2004·Granted Sep 11, 2007·0 cites·17 claims
- 1136US9142495B2Lead frame and semiconductor package manufactured by using the sameMDS CO LTD·Filed 2012·Granted Sep 22, 2015·0 cites·17 claims
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