Inventor · disambiguated record
Chia-Ming Cheng
Also filed as: CHENG CHIA-MING
62 granted patents·15 pending applications·105 citations·filing 2000–2025
98Inventor score
Top patents by PatentIndex Score
77 records- 0197US11521938B2Chip package including substrate inclined sidewall and redistribution lineXINTEC INC·Filed 2021·Granted Dec 6, 2022·3 cites·13 claims
- 0295US12341109B2Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Granted Jun 24, 2025·1 cites·18 claims
- 0392US8399963B2Chip package and fabrication method thereofTSAI CHIA-LUN·Filed 2010·Granted Mar 19, 2013·14 cites·13 claims
- 0490US9948918B2Method and apparatus for stereoscopic focus control of stereo cameraMEDIATEK INC·Filed 2012·Granted Apr 17, 2018·10 cites·22 claims
- 0589US11973095B2Method for forming chip package with second opening surrounding first opening having conductive structure thereinXINTEC INC·Filed 2022·Granted Apr 30, 2024·1 cites·19 claims
- 0687US8803326B2Chip packageXINTEC INC·Filed 2012·Granted Aug 12, 2014·7 cites·22 claims
- 0786US11784134B2Chip package and manufacturing method thereofXINTEC INC·Filed 2021·Granted Oct 10, 2023·1 cites·9 claims
- 0886US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 0984US10446504B2Chip package and method for forming the sameXINTEC INC·Filed 2018·Granted Oct 15, 2019·5 cites·20 claims
- 1080US11749618B2Chip package including substrate having through hole and redistribution lineXINTEC INC·Filed 2022·Granted Sep 5, 2023·0 cites·14 claims
- 1180US9123125B2Image processing method and associated apparatusMEDIATEK INC·Filed 2014·Granted Sep 1, 2015·4 cites·18 claims
- 1278US11450697B2Chip package with substrate having first opening surrounded by second opening and method for forming the sameXINTEC INC·Filed 2019·Granted Sep 20, 2022·2 cites·13 claims
- 1378US8362515B2Chip package and method for forming the sameCHENG CHIA-MING·Filed 2011·Granted Jan 29, 2013·5 cites·10 claims
- 1475US10424540B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Sep 24, 2019·2 cites·13 claims
- 1573US9349710B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 24, 2016·2 cites·20 claims
- 1672US9887229B2Sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Feb 6, 2018·2 cites·4 claims
- 1771US9601460B2Chip package including recess in side edgeXINTEC INC·Filed 2015·Granted Mar 21, 2017·2 cites·21 claims
- 1870US9967549B23D image capture method with 3D preview of preview images generated by monocular camera and related electronic device thereofMEDIATEK INC·Filed 2014·Granted May 8, 2018·2 cites·14 claims
- 1970US8633091B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Jan 21, 2014·2 cites·14 claims
- 2068US9318461B2Wafer level array of chips and method thereofXINTEC INC·Filed 2014·Granted Apr 19, 2016·2 cites·23 claims
- 2166USD955754SBattery operated toothbrushFOURSTAR GROUP INC·Filed 2021·Granted Jun 28, 2022·3 cites·1 claims
- 2266US10714528B2Chip package and manufacturing method thereofXINTEC INC·Filed 2018·Granted Jul 14, 2020·1 cites·19 claims
- 2366US9838672B2Apparatus and method for referring to motion status of image capture device to generate stereo image pair to auto-stereoscopic display for stereo previewMEDIATEK INC·Filed 2014·Granted Dec 5, 2017·1 cites·20 claims
- 2465US8431946B2Chip package and method for forming the sameCHIU HSIN-CHIH·Filed 2011·Granted Apr 30, 2013·2 cites·20 claims
- 2564US12477848B2Chip package and method for forming the sameXINTEC INC·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 2664US9275958B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Mar 1, 2016·1 cites·15 claims
- 2763US9620431B2Chip package including recess in side edgeXINTEC INC·Filed 2015·Granted Apr 11, 2017·1 cites·32 claims
- 2863US9165890B2Chip package comprising alignment mark and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 20, 2015·1 cites·20 claims
- 2963US8410599B2Power MOSFET packagePERNG BAW-CHING·Filed 2010·Granted Apr 2, 2013·2 cites·10 claims
- 3063US2025054849A1Chip package and method for forming the sameXINTEC INC·Filed 2024·Application pending·0 cites
- 3162US9690458B2Image viewing method for displaying portion of selected image based on user interaction input and related image viewing system and machine readable mediumMEDIATEK INC·Filed 2013·Granted Jun 27, 2017·1 cites·26 claims
- 3260US9912929B2Video frame processing methodMEDIATEK INC·Filed 2014·Granted Mar 6, 2018·0 cites·13 claims
- 3360US9554113B2Video frame processing methodMEDIATEK INC·Filed 2014·Granted Jan 24, 2017·0 cites·28 claims
- 3460US8849014B2Photographic systemCHENG CHIA-MING·Filed 2011·Granted Sep 30, 2014·1 cites·21 claims
- 3560US2024116751A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 3659US9799588B2Chip package and manufacturing method thereofXINTEC INC·Filed 2014·Granted Oct 24, 2017·0 cites·13 claims
- 3759US8633558B2Package structure for a chip and method for fabricating the sameLIN TA-HSUAN·Filed 2010·Granted Jan 21, 2014·2 cites·19 claims
- 3859US6350994B1Structure of critical dimension barUNITED MICROELECTRONICS CORP·Filed 2000·Granted Feb 26, 2002·7 cites·12 claims
- 3958US9955142B2On-line stereo camera calibration device and method for generating stereo camera parametersMEDIATEK INC·Filed 2014·Granted Apr 24, 2018·0 cites·18 claims
- 4058US8604578B2Chip packageCHIU HSIN-CHIH·Filed 2011·Granted Dec 10, 2013·1 cites·19 claims
- 4158US2023369528A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 4257US11355659B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Jun 7, 2022·0 cites·15 claims
- 4357US9018770B2Chip packageXINTEC INC·Filed 2014·Granted Apr 28, 2015·0 cites·7 claims
- 4457US8822325B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Sep 2, 2014·0 cites·11 claims
- 4557US8384174B2Chip packageCHIU HSIN-CHIH·Filed 2011·Granted Feb 26, 2013·1 cites·20 claims
- 4657US2024314428A1Adaptive camera scheme for low power slam in xrMEDIATEK INC·Filed 2024·Application pending·0 cites
- 4757US2024273745A1Adaptive frame rate for low power slam in xrMEDIATEK INC·Filed 2024·Application pending·0 cites
- 4856US2023369362A1Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Application pending·0 cites
- 4956US2018146182A1Video frame processing methodMEDIATEK INC·Filed 2018·Application pending·0 cites
- 5055US9064950B2Fabrication method for a chip packageXINTEC INC·Filed 2013·Granted Jun 23, 2015·0 cites·17 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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