Inventor · disambiguated record
Yoshimasa Sugimoto
Also filed as: SUGIMOTO YOSHIMASA
12 granted patents·3 pending applications·72 citations·filing 1985–2022
85Inventor score
Files withKYOCERA CORP11NAT INST MATERIALS SCIENCE1NEC CORP1OPTOELECTRONICS TECHNOLOGY RES1TAKESHITA HIROKI1
Top patents by PatentIndex Score
15 records- 0172US10157297B2RFID tag board, RFID tag, and RFID systemKYOCERA CORP·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 0272US4651187AAvalanche photodiodeNEC CORP·Filed 1985·Granted Mar 17, 1987·35 cites·4 claims
- 0361US2023163567A1Surface emitting quantum cascade laserNAT INST MATERIALS SCIENCE·Filed 2022·Application pending·0 cites
- 0460US4994140AMethod capable of forming a fine pattern without crystal defectsOPTOELECTRONICS TECHNOLOGY RES·Filed 1990·Granted Feb 19, 1991·35 cites·16 claims
- 0557US11763123B2RFID tagKYOCERA CORP·Filed 2020·Granted Sep 19, 2023·0 cites·11 claims
- 0653US11734543B2RFID tagKYOCERA CORP·Filed 2020·Granted Aug 22, 2023·0 cites·5 claims
- 0753US2024413027A1Semiconductor element mounting substrate and semiconductor deviceKYOCERA CORP·Filed 2022·Application pending·0 cites
- 0852US11275983B2RFID tags board, RFID tag and RFID systemKYOCERA CORP·Filed 2018·Granted Mar 15, 2022·0 cites·15 claims
- 0946US8560437B2Information processing apparatus, information processing method, and program productTAKESHITA HIROKI·Filed 2011·Granted Oct 15, 2013·0 cites·5 claims
- 1043US10582864B2Measurement sensor package and measurement sensorKYOCERA CORP·Filed 2017·Granted Mar 10, 2020·0 cites·18 claims
- 1140US8358180B2High frequency module comprising a transition between a wiring board and a waveguide and including a choke structure formed in the wiring boardKYOCERA CORP·Filed 2008·Granted Jan 22, 2013·0 cites·8 claims
- 1239US11717178B2Measurement sensor package and measurement sensorKYOCERA CORP·Filed 2016·Granted Aug 8, 2023·0 cites·14 claims
- 1339US10943077B2Tag board, RFID tag, and RFID systemKYOCERA CORP·Filed 2018·Granted Mar 9, 2021·0 cites·14 claims
- 1434US11166642B2Measurement sensor package and measurement sensorKYOCERA CORP·Filed 2016·Granted Nov 9, 2021·0 cites·13 claims
- 1527US2018358502A1Sensor substrate and sensor deviceKYOCERA CORP·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →