Inventor · disambiguated record
Il-Young Yoon
Also filed as: YOON IL-YOUNG
19 granted patents·17 pending applications·35 citations·filing 2003–2023
91Inventor score
Top patents by PatentIndex Score
36 records- 0189US9349651B2Semiconductor device and method for fabricating the sameKIM JONG-SU·Filed 2015·Granted May 24, 2016·11 cites·14 claims
- 0287US11011526B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 18, 2021·4 cites·20 claims
- 0387US10943908B2Method of forming semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·7 cites·16 claims
- 0483US10748968B2Image sensor having an etch stop layer on the insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 18, 2020·1 cites·20 claims
- 0575US10056466B2Methods for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 21, 2018·3 cites·20 claims
- 0670US10910266B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·1 cites·13 claims
- 0769US7785951B2Methods of forming integrated circuit devices having tensile and compressive stress layers therein and devices formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 31, 2010·3 cites·17 claims
- 0868US11251229B2Method of manufacturing an image sensor having an etch stop layer on an insulation layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 0961US11361995B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 1060US11581318B2Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 1160US7786520B2Embedded semiconductor device including planarization resistance patterns and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 31, 2010·2 cites·7 claims
- 1258US7709927B2Shallow trench isolation structures for semiconductor devices including wet etch barriersSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 4, 2010·1 cites·11 claims
- 1356US12426305B2Semiconductor device including transistor having source/drain contract with convex curved surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·17 claims
- 1456US8263454B2Embedded semiconductor device including planarization resistance patterns and method of manufacturing the sameLEE SE-YOUNG·Filed 2010·Granted Sep 11, 2012·1 cites·10 claims
- 1555US8652910B2Method for fabricating semiconductor device and device using sameKANG BO-KYEONG·Filed 2012·Granted Feb 18, 2014·1 cites·15 claims
- 1652US10964751B2Semiconductor device having plural dummy memory cellsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·20 claims
- 1751US2024395712A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1849US2007178644A1Semiconductor device having an insulating layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1948US2009286453A1Method and apparatus for chemical-mechanical polishingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2047US2009305438A1Trench isolation method of semiconductor device using chemical mechanical polishing processYOON IL-YOUNG·Filed 2009·Application pending·0 cites
- 2146US10711160B2Slurry compositions for polishing a metal layer and methods for fabricating semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·15 claims
- 2246US2010007021A1Methods of Fabricating Semiconductor Devices Including Porous Insulating LayersCHOO JAE-OUK·Filed 2009·Application pending·0 cites
- 2346US2009305501A1Method of fabricating semiconductor device using a chemical mechanical polishing processLEE TAE-HOON·Filed 2009·Application pending·0 cites
- 2445US2015364574A1Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2544US9023704B2Method for fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 5, 2015·0 cites·18 claims
- 2644US8709942B2Methods for fabricating semiconductor devicesPARK SANG-JINE·Filed 2012·Granted Apr 29, 2014·0 cites·20 claims
- 2744US2015056795A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2844US2008153253A1Chemical mechanical polishing process and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2944US2008045018A1Method of chemical-mechanical polishing and method of forming isolation layer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3044US2008132030A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3142US2007128991A1Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the sameYOON IL-YOUNG·Filed 2006·Application pending·0 cites
- 3238US2019341358A1Method of forming semiconductor device using polishing resistance patternSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3337US2005130408A1Method for forming metal wiring of semiconductor deviceFiled 2004·Application pending·0 cites
- 3436US2004079389A1Post-chemical mechanical polishing (CMP) cleaning methodFiled 2003·Application pending·0 cites
- 3536US2017040208A1Method of forming a plug, method of manufacturing a semiconductor device using the same, polishing chamber used for manufacturing the semiconductor device, and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 3634US2018362806A1Chemical mechanical polishing slurry composition and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →