Inventor · disambiguated record
Hidetaka Hattori
Also filed as: HATTORI HIDETAKA
16 granted patents·2 pending applications·168 citations·filing 2001–2020
93Inventor score
Top patents by PatentIndex Score
18 records- 0190US6495871B2Power semiconductor element capable of improving short circuit withstand capability while maintaining low on-voltage and method of fabricating the sameTOSHIBA KK·Filed 2001·Granted Dec 17, 2002·43 cites·7 claims
- 0286US6670658B2Power semiconductor element capable of improving short circuit withstand capability while maintaining low on-voltage and method of fabricating the sameTOSHIBA KK·Filed 2002·Granted Dec 30, 2003·28 cites·9 claims
- 0381US6620653B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted Sep 16, 2003·24 cites·25 claims
- 0480US10086563B2Method of producing composite materialMITSUBISHI HEAVY IND LTD·Filed 2013·Granted Oct 2, 2018·4 cites·3 claims
- 0573US6894347B2Power semiconductor element capable of improving short circuit withstand capability while maintaining low on-voltage and method of fabricating the sameTOSHIBA KK·Filed 2003·Granted May 17, 2005·13 cites·12 claims
- 0671US6921687B2Power semiconductor element capable of improving short circuit withstand capability while maintaining low on-voltage and method of fabricating the sameTOSHIBA KK·Filed 2004·Granted Jul 26, 2005·11 cites·13 claims
- 0769US7056779B2Semiconductor power deviceTOSHIBA KK·Filed 2003·Granted Jun 6, 2006·11 cites·20 claims
- 0869US6605858B2Semiconductor power deviceTOSHIBA KK·Filed 2002·Granted Aug 12, 2003·11 cites·14 claims
- 0963US6867454B2Power semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2001·Granted Mar 15, 2005·11 cites·40 claims
- 1062US6686613B2Punch through type power deviceTOSHIBA KK·Filed 2003·Granted Feb 3, 2004·8 cites·9 claims
- 1161US9227386B2Method for manufacturing resin-based composite materialHATTORI HIDETAKA·Filed 2011·Granted Jan 5, 2016·1 cites·4 claims
- 1261US9032799B2Apparatus and method for nondestructive inspectionHATTORI HIDETAKA·Filed 2009·Granted May 19, 2015·3 cites·19 claims
- 1358US11565487B2Repair device and composite material repair methodMITSUBISHI HEAVY IND LTD·Filed 2020·Granted Jan 31, 2023·0 cites·7 claims
- 1452US11603874B2Joint member of composite and joint structureMITSUBISHI HEAVY IND LTD·Filed 2020·Granted Mar 14, 2023·0 cites·20 claims
- 1548US10518487B2Artificial defect material and manufacturing method of FRP structureMITSUBISHI HEAVY IND LTD·Filed 2015·Granted Dec 31, 2019·0 cites·15 claims
- 1642US9403302B2Fabrication method and fabrication device for composite material hollow partHATTORI HIDETAKA·Filed 2012·Granted Aug 2, 2016·0 cites·8 claims
- 1742US2014147676A1Composite material including fiber reinforced resin and lightweight core and production method and device thereforHATTORI HIDETAKA·Filed 2012·Application pending·0 cites
- 1841US2014138872A1Method and device configured to produce at least two products including fiber reinforced resinHATTORI HIDETAKA·Filed 2012·Application pending·0 cites
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