Inventor · disambiguated record
Wiren D. Becker
Also filed as: BECKER WIREN · BECKER WIREN D · BECKER WIREN DALE
46 granted patents·5 pending applications·457 citations·filing 1994–2023
98Inventor score
Top patents by PatentIndex Score
51 records- 0197US9625220B1Structurally dynamic heat sinkIBM·Filed 2016·Granted Apr 18, 2017·19 cites·1 claims
- 0297US7362697B2Self-healing chip-to-chip interfaceIBM·Filed 2003·Granted Apr 22, 2008·92 cites·7 claims
- 0395US10247489B2Structural dynamic heat sinkIBM·Filed 2017·Granted Apr 2, 2019·7 cites·8 claims
- 0495US9644907B1Structurally dynamic heat sinkIBM·Filed 2015·Granted May 9, 2017·8 cites·14 claims
- 0594US10135162B1Method for fabricating a hybrid land grid array connectorIBM·Filed 2017·Granted Nov 20, 2018·8 cites·7 claims
- 0693US9548551B1DIMM connector region vias and routingIBM·Filed 2015·Granted Jan 17, 2017·10 cites·19 claims
- 0792US10128593B1Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the bodyIBM·Filed 2017·Granted Nov 13, 2018·6 cites·12 claims
- 0892US8050174B2Self-healing chip-to-chip interfaceIBM·Filed 2010·Granted Nov 1, 2011·11 cites·26 claims
- 0992US7233170B2Programmable driver delayIBM·Filed 2005·Granted Jun 19, 2007·22 cites·20 claims
- 1090US7813266B2Self-healing chip-to-chip interfaceIBM·Filed 2007·Granted Oct 12, 2010·11 cites·5 claims
- 1188US9444162B1DIMM connector region vias and routingIBM·Filed 2016·Granted Sep 13, 2016·4 cites·1 claims
- 1286US8261226B1Network flow based module bottom surface metal pin assignmentBECKER WIREN DALE·Filed 2011·Granted Sep 4, 2012·13 cites·25 claims
- 1386US7382844B2Methods to self-synchronize clocks on multiple chips in a systemIBM·Filed 2005·Granted Jun 3, 2008·19 cites·3 claims
- 1486US7284992B2Electronic package structures using land grid array interposers for module-to-board interconnectionIBM·Filed 2006·Granted Oct 23, 2007·13 cites·14 claims
- 1585US11133259B2Multi-chip package structure having high density chip interconnect bridge with embedded power distribution networkIBM·Filed 2019·Granted Sep 28, 2021·4 cites·20 claims
- 1685US7465882B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2006·Granted Dec 16, 2008·10 cites·5 claims
- 1784US11658378B2Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)IBM·Filed 2019·Granted May 23, 2023·4 cites·14 claims
- 1884US7113401B2System for airflow management in electronic enclosuresIBM·Filed 2004·Granted Sep 26, 2006·40 cites·27 claims
- 1980US6323050B1Method for evaluating decoupling capacitor placement for VLSI chipsIBM·Filed 2000·Granted Nov 27, 2001·26 cites·17 claims
- 2076US9638750B2Frequency-domain high-speed bus signal integrity compliance modelIBM·Filed 2015·Granted May 2, 2017·2 cites·11 claims
- 2173US8295419B2Method and apparatus for generating synchronization signals for synchronizing multiple chips in a systemHWANG CHARLIE C·Filed 2010·Granted Oct 23, 2012·4 cites·11 claims
- 2272US8018837B2Self-healing chip-to-chip interfaceIBM·Filed 2009·Granted Sep 13, 2011·2 cites·4 claims
- 2372US7987587B2Method of forming solid vias in a printed circuit boardIBM·Filed 2008·Granted Aug 2, 2011·5 cites·15 claims
- 2470US7826579B2Method and apparatus for generating synchronization signals for synchronizing multiple chips in a systemIBM·Filed 2006·Granted Nov 2, 2010·4 cites·5 claims
- 2569US6713686B2Apparatus and method for repairing electronic packagesIBM·Filed 2002·Granted Mar 30, 2004·16 cites·20 claims
- 2668US7355125B2Printed circuit board and chip moduleIBM·Filed 2005·Granted Apr 8, 2008·4 cites·1 claims
- 2765US6618843B2Method for evaluating decoupling capacitor placement for VLSI chipsIBM·Filed 2001·Granted Sep 9, 2003·9 cites·17 claims
- 2864US6529023B2Application and test methodology for use with compression land grid array connectorsIBM·Filed 2001·Granted Mar 4, 2003·11 cites·8 claims
- 2963US10257599B2Slack and strain control mechanismIBM·Filed 2015·Granted Apr 9, 2019·1 cites·12 claims
- 3063US8339803B2High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced costBECKER WIREN DALE·Filed 2009·Granted Dec 25, 2012·2 cites·13 claims
- 3163US6618844B2Method for evaluating decoupling capacitor placement for VLSI chipsIBM·Filed 2001·Granted Sep 9, 2003·8 cites·19 claims
- 3261US9627787B2DIMM connector region vias and routingIBM·Filed 2016·Granted Apr 18, 2017·1 cites·1 claims
- 3360US7985927B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2008·Granted Jul 26, 2011·1 cites·22 claims
- 3460US7897879B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2008·Granted Mar 1, 2011·1 cites·20 claims
- 3560US5477460AEarly high level net based analysis of simultaneous switchingIBM·Filed 1994·Granted Dec 19, 1995·37 cites·10 claims
- 3657US12266598B2Dense via pitch interconnect to increase wiring densityIBM·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 3755US2024321802A1Processor package substrate with high-speed top-surface connection to cable interconnectIBM·Filed 2023·Application pending·0 cites
- 3854US6437252B2Method and structure for reducing power noiseIBM·Filed 2000·Granted Aug 20, 2002·6 cites·18 claims
- 3953US2016071822A1OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLDER BALL GRID INTERCONNECTED THROUGH SILICON VIAS IN INTERMEDIATE INTEGRATED CIRCUIT CHIP CONNECTED TO CIRCUITRY IN AN UPPER INTEGRATED CIRCUIT CHIP THROUGH A GRID OF MICRO uC4 SOLDER BALLSIBM·Filed 2014·Application pending·0 cites
- 4052US11399428B2PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communicationIBM·Filed 2019·Granted Jul 26, 2022·0 cites·17 claims
- 4152US9733305B2Frequency-domain high-speed bus signal integrity compliance modelIBM·Filed 2015·Granted Aug 15, 2017·0 cites·6 claims
- 4251US9686053B2Frequency-domain high-speed bus signal integrity compliance modelIBM·Filed 2015·Granted Jun 20, 2017·0 cites·7 claims
- 4351US2024008186A1Real-time control of via stub drilling depth asymmetryIBM·Filed 2022·Application pending·0 cites
- 4450US9673941B2Frequency-domain high-speed bus signal integrity compliance modelIBM·Filed 2015·Granted Jun 6, 2017·0 cites·10 claims
- 4550US8683413B2Method for making high-speed ceramic modules with hybrid referencing scheme for improved performance and reduced costBECKER WIREN DALE·Filed 2012·Granted Mar 25, 2014·0 cites·15 claims
- 4648US2015170996A1Through-mesh-plane vias in a multi-layered packageIBM·Filed 2013·Application pending·0 cites
- 4747US2017053899A1OPTIMIZING POWER DISTRIBUTION FROM A POWER SOURCE THROUGH A C4 SOLDER BALL GRID INTERCONNECTED THROUGH SILICON VIAS IN INTERMEDIATE INTEGRATED CIRCUIT CHIP CONNECTED TO CIRCUITRY IN AN UPPER INTERGRATED CIRCUIT CHIP THROUGH A GRID OF MICRO uC4 SOLDER BALLSIBM·Filed 2016·Application pending·0 cites
- 4846US6058488AMethod of reducing computer module cycle timeIBM·Filed 1998·Granted May 2, 2000·12 cites·9 claims
- 4944US7742315B2Circuit on a printed circuit boardIBM·Filed 2005·Granted Jun 22, 2010·1 cites·4 claims
- 5041US6774836B2Method for delta-noise reductionIBM·Filed 2003·Granted Aug 10, 2004·3 cites·9 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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