Inventor · disambiguated record
Chia-Hsun Tseng
Also filed as: TSENG CHIA-HSUN
14 granted patents·37 citations·filing 2014–2017
87Inventor score
Files withUNITED MICROELECTRONICS CORP14
Top patents by PatentIndex Score
14 records- 0196US9660022B2Semiconductive device with a single diffusion break and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 23, 2017·17 cites·13 claims
- 0288US9548216B1Method of adjusting channel widths of semiconductive devicesUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 17, 2017·9 cites·12 claims
- 0388US9470987B1Overlay maskUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 18, 2016·5 cites·9 claims
- 0475US9583343B2Method of forming non-continuous line pattern and non-continuous line pattern structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 28, 2017·2 cites·7 claims
- 0572US9653345B1Method of fabricating semiconductor structure with improved critical dimension controlUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 16, 2017·2 cites·15 claims
- 0671US9746786B2Overlay maskUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 29, 2017·1 cites·11 claims
- 0762US9583568B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 28, 2017·1 cites·20 claims
- 0850US9711358B2Method of forming non-continuous line pattern and non-continuous line pattern structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 18, 2017·0 cites·11 claims
- 0949US9673040B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 6, 2017·0 cites·11 claims
- 1045US9964866B2Method of forming integrated circuitUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 8, 2018·0 cites·20 claims
- 1141US9543203B1Method of fabricating a semiconductor structure with a self-aligned contactUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 10, 2017·0 cites·14 claims
- 1240US9581898B2Manufacturing method of pattern transfer maskUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 28, 2017·0 cites·12 claims
- 1340US9530646B2Method of forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·18 claims
- 1438US10573649B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 25, 2020·0 cites·9 claims
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