Inventor · disambiguated record
Hironobu Kawahara
Also filed as: KAWAHARA HIRONOBU
39 granted patents·4 pending applications·1,075 citations·filing 1987–2007
98Inventor score
Top patents by PatentIndex Score
43 records- 0194US4795529APlasma treating method and apparatus thereforHITACHI LTD·Filed 1987·Granted Jan 3, 1989·184 cites·32 claims
- 0292US6427621B1Plasma processing device and plasma processing methodHITACHI LTD·Filed 2000·Granted Aug 6, 2002·42 cites·27 claims
- 0389US6677167B2Wafer processing apparatus and a wafer stage and a wafer processing methodHITACHI HIGH TECH CORP·Filed 2002·Granted Jan 13, 2004·39 cites·24 claims
- 0489US6624084B2Plasma processing equipment and plasma processing method using the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·47 cites·24 claims
- 0589US5007981AMethod of removing residual corrosive compounds by plasma etching followed by washingHITACHI LTD·Filed 1990·Granted Apr 16, 1991·106 cites·14 claims
- 0687US5868854AMethod and apparatus for processing samplesHITACHI LTD·Filed 1992·Granted Feb 9, 1999·67 cites·45 claims
- 0785US5556714AMethod of treating samplesHITACHI LTD·Filed 1994·Granted Sep 17, 1996·68 cites·12 claims
- 0885US5110408AProcess for etchingHITACHI LTD·Filed 1991·Granted May 5, 1992·95 cites·27 claims
- 0982US6537415B2Apparatus for processing samplesHITACHI LTD·Filed 2001·Granted Mar 25, 2003·17 cites·9 claims
- 1080US7608162B2Plasma processing apparatus and methodHITACHI LTD·Filed 2007·Granted Oct 27, 2009·4 cites·7 claims
- 1179US6549393B2Semiconductor wafer processing apparatus and methodHITACHI LTD·Filed 2001·Granted Apr 15, 2003·19 cites·8 claims
- 1278US5770100AMethod of treating samplesFiled 1996·Granted Jun 23, 1998·40 cites·8 claims
- 1376US6759338B2Plasma processing apparatus and methodHITACHI LTD·Filed 2001·Granted Jul 6, 2004·9 cites·5 claims
- 1472US4985113ASample treating method and apparatusHITACHI LTD·Filed 1990·Granted Jan 15, 1991·55 cites·20 claims
- 1571US5380397AMethod of treating samplesHITACHI LTD·Filed 1992·Granted Jan 10, 1995·35 cites·21 claims
- 1670US6537012B2Vacuum processing apparatus and a vacuum processing systemHITACHI LTD·Filed 2002·Granted Mar 25, 2003·11 cites·1 claims
- 1768US6649021B2Apparatus and method for plasma processing high-speed semiconductor circuits with increased yieldHITACHI LTD·Filed 2001·Granted Nov 18, 2003·9 cites·5 claims
- 1866US6537417B2Apparatus for processing samplesHITACHI LTD·Filed 2001·Granted Mar 25, 2003·6 cites·16 claims
- 1966US6388624B1Parallel-planar plasma processing apparatusHITACHI LTD·Filed 2001·Granted May 14, 2002·10 cites·8 claims
- 2066US6254721B1Method and apparatus for processing samplesHITACHI LTD·Filed 2000·Granted Jul 3, 2001·6 cites·9 claims
- 2165US5861601AMicrowave plasma processing apparatus and methodHITACHI LTD·Filed 1994·Granted Jan 19, 1999·45 cites·2 claims
- 2265US5200017ASample processing method and apparatusHITACHI LTD·Filed 1991·Granted Apr 6, 1993·38 cites·13 claims
- 2361US5320707ADry etching methodHITACHI LTD·Filed 1993·Granted Jun 14, 1994·27 cites·35 claims
- 2458US6235146B1Vacuum treatment system and its stageHITACHI LTD·Filed 1999·Granted May 22, 2001·22 cites·14 claims
- 2557US7288166B2Plasma processing apparatusHITACHI LTD·Filed 2003·Granted Oct 30, 2007·6 cites·6 claims
- 2657US6755935B2Plasma processing apparatusHITACHI LTD·Filed 2001·Granted Jun 29, 2004·5 cites·24 claims
- 2756US6558100B1Vacuum processing apparatus and a vacuum processing systemHITACHI LTD·Filed 2000·Granted May 6, 2003·4 cites·4 claims
- 2854US6867144B2Apparatus and method for plasma processing high-speed semiconductor circuits with increased yieldHITACHI LTD·Filed 2002·Granted Mar 15, 2005·3 cites·1 claims
- 2953US6656846B2Apparatus for processing samplesHITACHI LTD·Filed 2001·Granted Dec 2, 2003·2 cites·10 claims
- 3052US6989228B2Method and apparatus for processing samplesHITACHI LTD·Filed 2001·Granted Jan 24, 2006·3 cites·16 claims
- 3149US6036816AApparatus for processing a sample having a metal laminateHITACHI LTD·Filed 1995·Granted Mar 14, 2000·8 cites·28 claims
- 3248US7354525B2Specimen surface processing apparatus and surface processing methodHITACHI HIGH TECH CORP·Filed 2005·Granted Apr 8, 2008·0 cites·10 claims
- 3348US7132293B2Method and apparatus for processing samplesHITACHI LTD·Filed 2004·Granted Nov 7, 2006·1 cites·10 claims
- 3448US6413876B1Method for plasma processing high-speed semiconductor circuits with increased yieldHITACHI LTD·Filed 2001·Granted Jul 2, 2002·1 cites·3 claims
- 3547US5952245AMethod for processing samplesHITACHI LTD·Filed 1996·Granted Sep 14, 1999·7 cites·11 claims
- 3645US6329298B1Apparatus for treating samplesHITACHI LTD·Filed 1997·Granted Dec 11, 2001·8 cites·2 claims
- 3745US5900162APlasma etching method and apparatusHITACHI LTD·Filed 1991·Granted May 4, 1999·12 cites·12 claims
- 3844US6165377APlasma etching method and apparatusHITACHI LTD·Filed 1999·Granted Dec 26, 2000·9 cites·2 claims
- 3943US2007037292A1Method and apparatus for processing samplesKOJIMA MASAYUKI·Filed 2006·Application pending·0 cites
- 4042US2004040933A1Wafer processing apparatus and a wafer stage and a wafer processing methodFiled 2003·Application pending·0 cites
- 4141US2003029572A1Semiconductor wafer processing apparatus and methodFiled 2002·Application pending·0 cites
- 4239US2004171273A1Specimen surface processing apparatus and surface processing methodFiled 2003·Application pending·0 cites
- 4335US6077788AMethod and apparatus for processing samplesHITACHI LTD·Filed 1995·Granted Jun 20, 2000·5 cites·6 claims
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