Inventor · disambiguated record
Hua-Shu Wu
Also filed as: WU HUA-SHU · WU HUA-SHU IVAN
30 granted patents·4 pending applications·170 citations·filing 1999–2019
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG21TAIWAN SEMICONDUCTOR MFG CO LTD3UNITED MICROELECTRONICS CORP2WU HUA-SHU2CHANG CHIA-HUA1
Top patents by PatentIndex Score
34 records- 0189US10556792B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 11, 2020·3 cites·20 claims
- 0288US8012785B2Method of fabricating an integrated CMOS-MEMS deviceTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Sep 6, 2011·16 cites·20 claims
- 0387US10961118B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 0481US6534405B1Method of forming a MOSFET device featuring a dual salicide processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 18, 2003·30 cites·26 claims
- 0578US7453127B2Double-diffused-drain MOS device with floating non-insulator spacersTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 18, 2008·8 cites·20 claims
- 0675US7732299B2Process for wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jun 8, 2010·6 cites·20 claims
- 0771US9278853B2Manufacturing process of MEMS deviceMIRADIA INC·Filed 2014·Granted Mar 8, 2016·2 cites·16 claims
- 0871US8119992B2System for overlay measurement in semiconductor manufacturingLU HSIAO-TZU·Filed 2009·Granted Feb 21, 2012·2 cites·22 claims
- 0971US7295374B2Micro-lens and micro-lens fabrication methodTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 13, 2007·11 cites·16 claims
- 1070US6489237B1Method of patterning lines in semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 3, 2002·12 cites·13 claims
- 1169US10899608B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 1269US7582538B2Method of overlay measurement for alignment of patterns in semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 1, 2009·2 cites·29 claims
- 1368US10040681B2Method and system for MEMS devicesWU HUA SHU·Filed 2010·Granted Aug 7, 2018·3 cites·12 claims
- 1467US7468327B2Methods of fabricating a micromechanical structureTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 23, 2008·2 cites·8 claims
- 1564US8754529B2MEMS device with simplified electrical conducting pathsCHIEN YU-HAO·Filed 2012·Granted Jun 17, 2014·2 cites·12 claims
- 1663US7851331B2Bonding structures and methods of forming bonding structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 14, 2010·2 cites·16 claims
- 1763US6875689B2Method of patterning lines in semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·7 cites·18 claims
- 1863US6573188B1End point detection method for forming a patterned silicon layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 3, 2003·12 cites·11 claims
- 1962US8049323B2Chip holder with wafer level redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 1, 2011·2 cites·15 claims
- 2062US7255425B2Ink-channel wafer integrated with CMOS wafer for inkjet printhead and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 14, 2007·8 cites·21 claims
- 2153US7696766B2Ultra-fine pitch probe card structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Apr 13, 2010·2 cites·28 claims
- 2252US7094711B2Micro pipe manufacturing methodTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 22, 2006·5 cites·20 claims
- 2351US6080674AMethod for forming via holesUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 27, 2000·18 cites·17 claims
- 2450US8278724B2Methods of fabricating a micromechanical structureCHANG CHIA-HUA·Filed 2008·Granted Oct 2, 2012·0 cites·5 claims
- 2550US7728396B2Semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jun 1, 2010·0 cites·20 claims
- 2646US8084361B2Semiconductor fabrication method suitable for MEMSHUANG TSUNG-CHENG·Filed 2007·Granted Dec 27, 2011·2 cites·20 claims
- 2746US7459344B2Method for forming micromachined structureTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 2, 2008·0 cites·23 claims
- 2845US2011042827A1Bonding structures and methods of forming bonding structuresTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
- 2943US7198975B2Semiconductor methods and structuresTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 3, 2007·0 cites·13 claims
- 3043US6187668B1Method of forming self-aligned unlanded via holesUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 13, 2001·11 cites·17 claims
- 3139US2006189023A1Three dimensional structure formed by using an adhesive silicon wafer processTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3237US7011933B2Method for manufacturing micro-optical mirror arraysTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 14, 2006·0 cites·32 claims
- 3337US2008018350A1Test probe for integrated circuits with ultra-fine pitch terminalsCHAO CLINTON·Filed 2006·Application pending·0 cites
- 3429US2012146452A1Microelectromechanical system device and semi-manufacture and manufacturing method thereofWU HUA-SHU·Filed 2011·Application pending·0 cites
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