Inventor · disambiguated record
Hsin-Hui Lee
Also filed as: LEE HSIN-HUI
57 granted patents·11 pending applications·835 citations·filing 2001–2021
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG37VANGUARD INT SEMICONDUCT CORP16LEE HSIN-HUI5TAIWAN SEMICONDUCTOR MFG CO LTD2CHEN YEN-MING1
Top patents by PatentIndex Score
68 records- 0199US7361990B2Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump padsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Apr 22, 2008·134 cites·15 claims
- 0297US6743660B2Method of making a wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 1, 2004·110 cites·20 claims
- 0396US8039315B2Thermally enhanced wafer level packageTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Oct 18, 2011·29 cites·19 claims
- 0496US7183137B2Method for dicing semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 27, 2007·102 cites·15 claims
- 0596US7148560B2IC chip package structure and underfill processTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 12, 2006·45 cites·18 claims
- 0695US7265034B2Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw bladeTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 4, 2007·33 cites·20 claims
- 0794US9035445B2Seal ring structure with a metal padTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 19, 2015·14 cites·20 claims
- 0894US7294937B2Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peelingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 13, 2007·26 cites·30 claims
- 0990US6636313B2Method of measuring photoresist and bump misalignmentTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 21, 2003·37 cites·20 claims
- 1089US6756294B1Method for improving bump reliability for flip chip devicesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jun 29, 2004·53 cites·26 claims
- 1187US8283754B2Seal ring structure with metal padLIN JENG-SHYAN·Filed 2010·Granted Oct 9, 2012·7 cites·15 claims
- 1285US10651218B1Optical sensor structure and method for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted May 12, 2020·4 cites·20 claims
- 1385US7126225B2Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peelingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 24, 2006·29 cites·14 claims
- 1484US8647963B2Structure and method of wafer level chip molded packagingLEE HSIN-HUI·Filed 2010·Granted Feb 11, 2014·8 cites·22 claims
- 1584US7952167B2Scribe line layout designTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 31, 2011·12 cites·20 claims
- 1683US7112882B2Structures and methods for heat dissipation of semiconductor integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 26, 2006·30 cites·21 claims
- 1778US6602775B1Method to improve reliability for flip-chip device for limiting pad designTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 5, 2003·29 cites·25 claims
- 1875US7772691B2Thermally enhanced wafer level packageTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 10, 2010·5 cites·19 claims
- 1974US7256071B2Underfilling efficiency by modifying the substrate design of flip chipsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 14, 2007·5 cites·14 claims
- 2074US6805279B2Fluxless bumping process using ionsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 19, 2004·28 cites·28 claims
- 2172US7642631B2Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from waferTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 5, 2010·4 cites·20 claims
- 2272US7491624B2Method of manufacturing low CTE substrates for use with low-k flip-chip package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 17, 2009·4 cites·15 claims
- 2372US6715524B2DFR laminating and film removing systemTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 6, 2004·16 cites·16 claims
- 2471US10699092B2Optical sensor and manufacturing method thereofVANGUARD INT SEMICONDUCT CORP·Filed 2018·Granted Jun 30, 2020·1 cites·20 claims
- 2571US7468321B2Application of impressed-current cathodic protection to prevent metal corrosion and oxidationTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 23, 2008·4 cites·20 claims
- 2669US11989966B2Semiconductor devices and methods for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2021·Granted May 21, 2024·0 cites·19 claims
- 2769US8409881B2Multi-project wafer and method of making sameCHENG WILLIAM·Filed 2010·Granted Apr 2, 2013·1 cites·10 claims
- 2869US7906425B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 15, 2011·4 cites·10 claims
- 2968US6974659B2Method of forming a solder ball using a thermally stable resinous protective layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 13, 2005·15 cites·19 claims
- 3067US7134199B2Fluxless bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 14, 2006·10 cites·13 claims
- 3165US7851272B2Multi-project wafer and method of making sameTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 14, 2010·1 cites·21 claims
- 3264US10935805B2Optical sensor and method for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted Mar 2, 2021·1 cites·19 claims
- 3363US11271024B2Semiconductor device and method for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted Mar 8, 2022·0 cites·20 claims
- 3463US8524595B2Semiconductor package structuresLII MIRNG-JI·Filed 2009·Granted Sep 3, 2013·2 cites·20 claims
- 3562US11177397B2Semiconductor devices and methods for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2020·Granted Nov 16, 2021·0 cites·16 claims
- 3661US7075016B2Underfilling efficiency by modifying the substrate design of flip chipsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jul 11, 2006·8 cites·16 claims
- 3760US11152422B2Semiconductor devices and methods for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted Oct 19, 2021·0 cites·15 claims
- 3860US7170159B1Low CTE substrates for use with low-k flip-chip package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 30, 2007·1 cites·15 claims
- 3957US10915727B2Optical sensor and method for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2018·Granted Feb 9, 2021·0 cites·24 claims
- 4056US8497584B2Method to improve bump reliability for flip chip deviceCHEN YEN-MING·Filed 2004·Granted Jul 30, 2013·6 cites·9 claims
- 4156US6797075B2Ferris wheel-like stripping or cleaning mechanism for semiconductor fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 28, 2004·5 cites·18 claims
- 4254US11315964B2Optical sensors and methods for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted Apr 26, 2022·0 cites·16 claims
- 4354US9064817B2Structure of wafer level chip molded packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 23, 2015·0 cites·20 claims
- 4454US7276454B2Application of impressed-current cathodic protection to prevent metal corrosion and oxidationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 2, 2007·5 cites·20 claims
- 4553US10770602B1Optical sensor and method for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted Sep 8, 2020·0 cites·19 claims
- 4653US7154185B2Encapsulation method for SBGATAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Dec 26, 2006·6 cites·14 claims
- 4752US9812409B2Seal ring structure with a metal padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·0 cites·20 claims
- 4851US11621287B2Optical sensor device with reduced thickness and method for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2020·Granted Apr 4, 2023·0 cites·21 claims
- 4951US8288842B2Method for dicing semiconductor wafersLEE HSIN-HUI·Filed 2007·Granted Oct 16, 2012·0 cites·19 claims
- 5050US11482552B2Semiconductor devices and methods for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2019·Granted Oct 25, 2022·0 cites·19 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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