Inventor · disambiguated record
Timothy J. Dalton
Also filed as: COLBURN MATTHEW E · DALTON TIMOTHY · DALTON TIMOTHY J · DALTON TIMOTHY JOSEPH
175 granted patents·27 pending applications·4,319 citations·filing 1993–2014
99Inventor score
Top patents by PatentIndex Score
202 records- 0199US7193423B1Wafer-to-wafer alignmentsIBM·Filed 2005·Granted Mar 20, 2007·231 cites·4 claims
- 0299US7045453B2Very low effective dielectric constant interconnect structures and methods for fabricating the sameIBM·Filed 2005·Granted May 16, 2006·221 cites·9 claims
- 0398US9201041B2Extended gate sensor for pH sensingIBM·Filed 2013·Granted Dec 1, 2015·57 cites·13 claims
- 0498US6153935ADual etch stop/diffusion barrier for damascene interconnectsIBM·Filed 1999·Granted Nov 28, 2000·376 cites·22 claims
- 0598US5450205AApparatus and method for real-time measurement of thin film layer thickness and changes thereofMASSACHUSETTS INST TECHNOLOGY·Filed 1993·Granted Sep 12, 1995·319 cites·29 claims
- 0697US7531407B2Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating sameIBM·Filed 2006·Granted May 12, 2009·61 cites·11 claims
- 0797US7285477B1Dual wired integrated circuit chipsIBM·Filed 2006·Granted Oct 23, 2007·49 cites·23 claims
- 0897US6451712B1Method for forming a porous dielectric material layer in a semiconductor device and device formedIBM·Filed 2000·Granted Sep 17, 2002·123 cites·43 claims
- 0997US6358832B1Method of forming barrier layers for damascene interconnectsIBM·Filed 2000·Granted Mar 19, 2002·119 cites·27 claims
- 1096US7514271B2Method of forming high density planar magnetic domain wall memoryIBM·Filed 2007·Granted Apr 7, 2009·36 cites·10 claims
- 1196US7023093B2Very low effective dielectric constant interconnect Structures and methods for fabricating the sameIBM·Filed 2002·Granted Apr 4, 2006·112 cites·22 claims
- 1296US6635506B2Method of fabricating micro-electromechanical switches on CMOS compatible substratesIBM·Filed 2001·Granted Oct 21, 2003·155 cites·15 claims
- 1396US6551924B1Post metalization chem-mech polishing dielectric etchIBM·Filed 1999·Granted Apr 22, 2003·248 cites·29 claims
- 1495US7657995B2Method of fabricating a microelectromechanical system (MEMS) switchIBM·Filed 2007·Granted Feb 9, 2010·29 cites·4 claims
- 1595US7435671B2Trilayer resist scheme for gate etching applicationsIBM·Filed 2006·Granted Oct 14, 2008·24 cites·14 claims
- 1695US7402532B2Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layerIBM·Filed 2006·Granted Jul 22, 2008·28 cites·1 claims
- 1795US7394332B2Micro-cavity MEMS device and method of fabricating sameIBM·Filed 2005·Granted Jul 1, 2008·45 cites·18 claims
- 1895US7309649B2Method of forming closed air gap interconnects and structures formed therebyIBM·Filed 2006·Granted Dec 18, 2007·33 cites·15 claims
- 1995US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 2095US6815329B2Multilayer interconnect structure containing air gaps and method for makingIBM·Filed 2002·Granted Nov 9, 2004·105 cites·13 claims
- 2194US7670921B2Structure and method for self aligned vertical plate capacitorIBM·Filed 2006·Granted Mar 2, 2010·31 cites·12 claims
- 2294US7662722B2Air gap under on-chip passive deviceIBM·Filed 2007·Granted Feb 16, 2010·31 cites·17 claims
- 2394US7393776B2Method of forming closed air gap interconnects and structures formed therebyIBM·Filed 2006·Granted Jul 1, 2008·26 cites·6 claims
- 2494US7361991B2Closed air gap interconnect structureIBM·Filed 2003·Granted Apr 22, 2008·67 cites·11 claims
- 2594US6649531B2Process for forming a damascene structureIBM·Filed 2001·Granted Nov 18, 2003·87 cites·20 claims
- 2693US8084825B2Trilayer resist scheme for gate etching applicationsFULLER NICHOLAS C·Filed 2008·Granted Dec 27, 2011·22 cites·14 claims
- 2793US6617690B1Interconnect structures containing stress adjustment cap layerIBM·Filed 2002·Granted Sep 9, 2003·79 cites·22 claims
- 2892US8013342B2Double-sided integrated circuit chipsIBM·Filed 2007·Granted Sep 6, 2011·19 cites·16 claims
- 2992US7838873B2Structure for stochastic integrated circuit personalizationIBM·Filed 2008·Granted Nov 23, 2010·17 cites·9 claims
- 3092US7402463B2Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse applicationIBM·Filed 2005·Granted Jul 22, 2008·21 cites·1 claims
- 3192US7348870B2Structure and method of fabricating a hinge type MEMS switchIBM·Filed 2005·Granted Mar 25, 2008·21 cites·13 claims
- 3292US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 3391US8486511B2Pattern formation employing self-assembled materialBLACK CHARLES T·Filed 2012·Granted Jul 16, 2013·9 cites·20 claims
- 3491US8129286B2Reducing effective dielectric constant in semiconductor devicesEDELSTEIN DANIEL C·Filed 2008·Granted Mar 6, 2012·11 cites·32 claims
- 3591US7892940B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Feb 22, 2011·11 cites·25 claims
- 3691US7749778B2Addressable hierarchical metal wire test methodologyIBM·Filed 2007·Granted Jul 6, 2010·17 cites·1 claims
- 3791US7741721B2Electrical fuses and resistors having sublithographic dimensionsIBM·Filed 2007·Granted Jun 22, 2010·14 cites·6 claims
- 3891US7473979B2Semiconductor integrated circuit devices having high-Q wafer back-side capacitorsIBM·Filed 2006·Granted Jan 6, 2009·18 cites·19 claims
- 3991US7405147B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2004·Granted Jul 29, 2008·35 cites·31 claims
- 4090US8024012B2Intelligent wireless power charging systemIBM·Filed 2008·Granted Sep 20, 2011·37 cites·25 claims
- 4190US7923712B2Phase change memory element with a peripheral connection to a thin film electrodeIBM·Filed 2009·Granted Apr 12, 2011·17 cites·20 claims
- 4290US7851321B2Semiconductor integrated circuit devices having high-Q wafer back-side capacitorsIBM·Filed 2009·Granted Dec 14, 2010·16 cites·7 claims
- 4390US7049209B1De-fluorination of wafer surface and related structureIBM·Filed 2005·Granted May 23, 2006·16 cites·18 claims
- 4489US8343868B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2011·Granted Jan 1, 2013·6 cites·20 claims
- 4589US8023305B2High density planar magnetic domain wall memory apparatusIBM·Filed 2008·Granted Sep 20, 2011·11 cites·10 claims
- 4689US8009453B2High density planar magnetic domain wall memory apparatusIBM·Filed 2008·Granted Aug 30, 2011·15 cites·10 claims
- 4789US7670927B2Double-sided integrated circuit chipsIBM·Filed 2006·Granted Mar 2, 2010·15 cites·12 claims
- 4889US7241681B2Bilayered metal hardmasks for use in dual damascene etch schemesIBM·Filed 2006·Granted Jul 10, 2007·13 cites·8 claims
- 4989US7223654B2MIM capacitor and method of fabricating sameIBM·Filed 2005·Granted May 29, 2007·16 cites·34 claims
- 5089US7105445B2Interconnect structures with encasing cap and methods of making thereofIBM·Filed 2005·Granted Sep 12, 2006·11 cites·24 claims
Showing the top 50 of 202 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →