Inventor · disambiguated record
Thomas J. Fitzgerald
Also filed as: FITZGERALD THOMAS · FITZGERALD THOMAS H · FITZGERALD THOMAS J · FITZGERALD THOMAS JOHN
35 granted patents·9 pending applications·1,389 citations·filing 1982–2023
98Inventor score
Top patents by PatentIndex Score
44 records- 0195US5369778AData processor that customizes program behavior by using a resource retrieval capabilityWANG LABORATORIES·Filed 1993·Granted Nov 29, 1994·523 cites·5 claims
- 0294US6504242B1Electronic assembly having a wetting layer on a thermally conductive heat spreaderINTEL CORP·Filed 2001·Granted Jan 7, 2003·128 cites·31 claims
- 0394US6504723B1Electronic assembly having solder thermal interface between a die substrate and a heat spreaderINTEL CORP·Filed 2001·Granted Jan 7, 2003·56 cites·15 claims
- 0494US5354488AFluid responsive to a magnetic fieldTRW INC·Filed 1992·Granted Oct 11, 1994·108 cites·19 claims
- 0593US7239517B2Integrated heat spreader and method for usingINTEL CORP·Filed 2005·Granted Jul 3, 2007·25 cites·7 claims
- 0691US9515003B1Embedded air core inductors for integrated circuit package substrates with thermal conductorINTEL CORP·Filed 2015·Granted Dec 6, 2016·18 cites·20 claims
- 0791US7102226B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2005·Granted Sep 5, 2006·18 cites·8 claims
- 0891US6751099B2Coated heat spreadersINTEL CORP·Filed 2001·Granted Jun 15, 2004·47 cites·15 claims
- 0988US7672132B2Electronic packaging apparatus and methodINTEL CORP·Filed 2006·Granted Mar 2, 2010·21 cites·28 claims
- 1088US7362580B2Electronic assembly having an indium wetting layer on a thermally conductive bodyINTEL CORP·Filed 2004·Granted Apr 22, 2008·41 cites·20 claims
- 1188US6848172B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2001·Granted Feb 1, 2005·41 cites·10 claims
- 1287US8179337B2Mobile projected setsWILZBACH GREGORY A·Filed 2008·Granted May 15, 2012·41 cites·21 claims
- 1384US5571848AMethod for producing a microcellular foamMASSACHUSETTS INST TECHNOLOGY·Filed 1995·Granted Nov 5, 1996·52 cites·33 claims
- 1482US8490550B2Roller coaster with articulable seat backsCRAWFORD DAVID W·Filed 2011·Granted Jul 23, 2013·10 cites·19 claims
- 1582US7882683B2Systems and methods of processing and transporting wasteTDM AMERICA LLC·Filed 2006·Granted Feb 8, 2011·13 cites·18 claims
- 1681US9330999B2Multi-component integrated heat spreader for multi-chip packagesINTEL CORP·Filed 2014·Granted May 3, 2016·7 cites·11 claims
- 1780US7527090B2Heat dissipating device with preselected designed interface for thermal interface materialsINTEL CORP·Filed 2003·Granted May 5, 2009·24 cites·13 claims
- 1879US7364063B2Thermally coupling an integrated heat spreader to a heat sink baseINTEL CORP·Filed 2004·Granted Apr 29, 2008·23 cites·15 claims
- 1979US7256058B2Device and method for package warp compensation in an integrated heat spreaderINTEL CORP·Filed 2006·Granted Aug 14, 2007·6 cites·30 claims
- 2077US5836075AProcess for forming combustion turbine components by transient liquid phase bondingWESTINGHOUSE ELECTRIC CORP·Filed 1996·Granted Nov 17, 1998·40 cites·17 claims
- 2173US4678403ALiquid level sensor for controlling pump operationRUDY RICHARD M·Filed 1985·Granted Jul 7, 1987·34 cites·5 claims
- 2272US7996989B2Heat dissipating device with preselected designed interface for thermal interface materialsINTEL CORP·Filed 2008·Granted Aug 16, 2011·4 cites·3 claims
- 2372US6817091B2Electronic assembly having solder thermal interface between a die substrate and a heat spreaderINTEL CORP·Filed 2002·Granted Nov 16, 2004·13 cites·7 claims
- 2465US7219421B2Method of a coating heat spreaderINTEL CORP·Filed 2004·Granted May 22, 2007·9 cites·15 claims
- 2563US7553702B2Integrating a heat spreader with an interface material having reduced void sizeINTEL CORP·Filed 2007·Granted Jun 30, 2009·2 cites·18 claims
- 2663US7081669B2Device and system for heat spreader with controlled thermal expansionINTEL CORP·Filed 2003·Granted Jul 25, 2006·10 cites·32 claims
- 2761US10763188B2Integrated heat spreader having electromagnetically-formed featuresINTEL CORP·Filed 2015·Granted Sep 1, 2020·1 cites·4 claims
- 2861US4463502AMagnetic distributor-downcomer for fluidized beds and magnetic valve to control the flow of solidsFITZGERALD THOMAS J·Filed 1982·Granted Aug 7, 1984·21 cites·31 claims
- 2956US7160758B2Electronic packaging apparatus and methodINTEL CORP·Filed 2004·Granted Jan 9, 2007·7 cites·42 claims
- 3053US10236233B2Heat spreaders with integrated preformsINTEL CORP·Filed 2017·Granted Mar 19, 2019·0 cites·20 claims
- 3152US2008156457A1Thermally coupling an integrated heat spreader to a heat sink baseSCHAENZER MATTHEW J·Filed 2008·Application pending·0 cites
- 3251US9799584B2Heat spreaders with integrated preformsINTEL CORP·Filed 2015·Granted Oct 24, 2017·0 cites·16 claims
- 3350US2023313367A1Methods and apparatus for chamber lid coolingASM IP HOLDING BV·Filed 2023·Application pending·0 cites
- 3449US12483781B2Power manager to support less-than-nominal conditions in a machine vision systemZEBRA TECH CORP·Filed 2021·Granted Nov 25, 2025·0 cites·20 claims
- 3549US2008153210A1Electronic assembly having an indium wetting layer on a thermally conductive bodyHUA FAY·Filed 2008·Application pending·0 cites
- 3645US2023089167A1Gas-phase reactor system and method of cleaning sameASM IP HOLDING BV·Filed 2022·Application pending·0 cites
- 3744US5632716AApparatus and method of muscle training in dynamic cardiomyoplastyTELECTRONICS PACING SYST·Filed 1996·Granted May 27, 1997·45 cites·7 claims
- 3844US2006219108A1Apparatus and method for production of personalized gift-wrapDORRELL CHERYL B·Filed 2006·Application pending·0 cites
- 3944US2023175126A1Reactant vapor delivery systems for semiconductor processing tools and methodsASM IP HOLDING BV·Filed 2022·Application pending·0 cites
- 4041US2007228112A1Method and arrangement for forming a microelectronic packageSHI WEI·Filed 2006·Application pending·0 cites
- 4139US12160925B2Enhanced device discovery to support multiple clients and high data bandwidthZEBRA TECH CORP·Filed 2022·Granted Dec 3, 2024·0 cites·18 claims
- 4239US2007295482A1Heat spreader for use in conjunction with a semiconducting device and method of manufacturing sameFITZGERALD THOMAS J·Filed 2006·Application pending·0 cites
- 4331US2019027379A1Sintered heat spreaders with insertsINTEL CORP·Filed 2015·Application pending·0 cites
- 4428US4777619AMethod of assuring a proper computer subsystem configurationHONEYWELL BULL·Filed 1987·Granted Oct 11, 1988·1 cites·13 claims
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