Inventor · disambiguated record

Joe Saucedo

Also filed as: SAUCEDO JOE R

1 granted patent·2 citations·filing 2017–2017

18Inventor score

Technology areasH10W

Files withINTEL CORP1

Top patents by PatentIndex Score

1 record

0168US11296052B2TSV-less die stacking using plated pillars/through mold interconnectINTEL CORP·Filed 2017·Granted Apr 5, 2022·2 cites·14 claims

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