Inventor · disambiguated record
Karl Heinz Priewasser
Also filed as: PRIEWASSER KARL · PRIEWASSER KARL HEINZ
52 granted patents·5 pending applications·113 citations·filing 2004–2024
97Inventor score
Top patents by PatentIndex Score
57 records- 0196US11201126B2Method of producing a substrate and system for producing a substrateDISCO CORP·Filed 2020·Granted Dec 14, 2021·4 cites·12 claims
- 0292US9595463B2Wafer processing methodDISCO CORP·Filed 2016·Granted Mar 14, 2017·7 cites·3 claims
- 0389US10319593B2Wafer thinning methodDISCO CORP·Filed 2016·Granted Jun 11, 2019·6 cites·4 claims
- 0487US10312099B2Wafer processing methodDISCO CORP·Filed 2018·Granted Jun 4, 2019·4 cites·8 claims
- 0586US12062533B2Method of producing a substrate and system for producing a substrateDISCO CORP·Filed 2021·Granted Aug 13, 2024·1 cites·11 claims
- 0686US7520309B2Method for adhering protecting tape of wafer and adhering apparatusDISCO CORP·Filed 2006·Granted Apr 21, 2009·11 cites·2 claims
- 0785US10784164B2Method of dividing waferDISCO CORP·Filed 2016·Granted Sep 22, 2020·4 cites·18 claims
- 0883US10242913B2Method of processing a wafer and wafer processing systemDISCO CORP·Filed 2018·Granted Mar 26, 2019·3 cites·14 claims
- 0981US10727128B2Method of processing a waferDISCO CORP·Filed 2019·Granted Jul 28, 2020·3 cites·10 claims
- 1081US9397000B2Wafer processing methodDISCO CORP·Filed 2015·Granted Jul 19, 2016·3 cites·8 claims
- 1180US11133219B2Method of processing a waferDISCO CORP·Filed 2019·Granted Sep 28, 2021·2 cites·10 claims
- 1280US10032669B2Wafer dividing methodDISCO CORP·Filed 2016·Granted Jul 24, 2018·3 cites·20 claims
- 1379US9437439B2Processing method for wafer having chamfered portion along the outer circumference thereof followed by thinning and separatingDISCO CORP·Filed 2012·Granted Sep 6, 2016·4 cites·2 claims
- 1478US7115485B2Method for processing waferDISCO CORP·Filed 2004·Granted Oct 3, 2006·20 cites·4 claims
- 1577US11011406B2Method of processing a substrateDISCO CORP·Filed 2019·Granted May 18, 2021·2 cites·26 claims
- 1677US9935010B2Method of processing a wafer and wafer processing systemDISCO CORP·Filed 2017·Granted Apr 3, 2018·2 cites·12 claims
- 1775US9472442B2Wafer processing methodDISCO CORP·Filed 2015·Granted Oct 18, 2016·2 cites·3 claims
- 1875US8815644B2Wafer processing methodDISCO CORP·Filed 2013·Granted Aug 26, 2014·3 cites·3 claims
- 1974US9905453B2Protective sheeting for use in processing a semiconductor-sized wafer and semiconductor-sized wafer processing methodPRIEWASSER KARL HEINZ·Filed 2014·Granted Feb 27, 2018·3 cites·20 claims
- 2074US7708855B2Method for processing a semiconductor waferDISCO CORP·Filed 2006·Granted May 4, 2010·4 cites·8 claims
- 2174US7413501B2Method for concave grinding of wafer and unevenness-absorbing padDISCO CORP·Filed 2007·Granted Aug 19, 2008·5 cites·9 claims
- 2272US11469120B2Device and method for attaching protective tape to semiconductor waferDISCO HI TEC EUROPE GMBH·Filed 2018·Granted Oct 11, 2022·2 cites·5 claims
- 2371US9768049B2Support plate and method for forming support plateDISCO CORP·Filed 2016·Granted Sep 19, 2017·1 cites·16 claims
- 2470US10727127B2Method of processing a substrateDISCO CORP·Filed 2018·Granted Jul 28, 2020·1 cites·17 claims
- 2567US11784138B2Wafer processing with a protective film and peripheral adhesiveDISCO CORP·Filed 2021·Granted Oct 10, 2023·0 cites·6 claims
- 2665US10475676B2Workpiece processing methodDISCO CORP·Filed 2018·Granted Nov 12, 2019·1 cites·3 claims
- 2763US11626324B2Method of processing a waferDISCO CORP·Filed 2021·Granted Apr 11, 2023·0 cites·15 claims
- 2863US7087502B2Method for generating chip stacksINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 8, 2006·12 cites·6 claims
- 2963US2025083269A1Workpiece supportDISCO CORP·Filed 2024·Application pending·0 cites
- 3060US12472581B2Method of processing a substrate and system for processing a substrateDISCO CORP·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 3159US12094751B2Method of processing a substrateDISCO CORP·Filed 2022·Granted Sep 17, 2024·0 cites·8 claims
- 3258US11637074B2Method of processing waferDISCO CORP·Filed 2018·Granted Apr 25, 2023·0 cites·27 claims
- 3352US11823941B2Method of processing a substrateDISCO CORP·Filed 2020·Granted Nov 21, 2023·0 cites·12 claims
- 3451US11894271B2Method of processing waferDISCO CORP·Filed 2021·Granted Feb 6, 2024·0 cites·3 claims
- 3550US11559974B2Microfluidic system or device and method of manufacturing a microfluidic system or deviceDISCO CORP·Filed 2018·Granted Jan 24, 2023·0 cites·16 claims
- 3650US11424161B2Substrate processing methodDISCO CORP·Filed 2020·Granted Aug 23, 2022·0 cites·13 claims
- 3748US12243766B2Back grinding adhesive sheet, and method for manufacturing semiconductor waferDISCO CORP·Filed 2020·Granted Mar 4, 2025·0 cites·13 claims
- 3847US2015332952A1Support plate and method for forming support plateDISCO CORP·Filed 2015·Application pending·0 cites
- 3947US2008248730A1Wafer processing methodDISCO CORP·Filed 2008·Application pending·0 cites
- 4046US12312512B2Adhesive sheet for backgrinding and production method for semiconductor waferDISCO CORP·Filed 2020·Granted May 27, 2025·0 cites·5 claims
- 4146US12224207B2Method of processing a workpiece and system for processing a workpieceDISCO CORP·Filed 2020·Granted Feb 11, 2025·0 cites·19 claims
- 4245US10682728B2Method of processing a substrateDISCO CORP·Filed 2018·Granted Jun 16, 2020·0 cites·20 claims
- 4345US8828803B2Resin sealing method for semiconductor chipsDISCO CORP·Filed 2013·Granted Sep 9, 2014·0 cites·6 claims
- 4444US10991612B2Method of processing wafer having protrusions on the back sideDISCO CORP·Filed 2017·Granted Apr 27, 2021·0 cites·14 claims
- 4544US9831128B2Method of processing a substrateDISCO CORP·Filed 2016·Granted Nov 28, 2017·0 cites·16 claims
- 4644US9006085B2Adhesive and protective member used in a wafer processing methodDISCO CORP·Filed 2013·Granted Apr 14, 2015·0 cites·2 claims
- 4743US9704749B2Method of dividing wafer into diesDISCO CORP·Filed 2015·Granted Jul 11, 2017·0 cites·12 claims
- 4842US11676833B2Protective sheet for use in processing wafer, handling system for wafer, and combination of wafer and protective sheetingDISCO CORP·Filed 2017·Granted Jun 13, 2023·0 cites·16 claims
- 4942US10702946B2Substrate processing methodDISCO CORP·Filed 2017·Granted Jul 7, 2020·0 cites·14 claims
- 5041US10991623B2Wafer processing methodDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·3 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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