Inventor · disambiguated record
Chang-Yi Lan
Also filed as: LAN CHANG-YI
5 granted patents·2 pending applications·1 citations·filing 2012–2018
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0160US8796867B2Semiconductor package and fabrication method thereofHSIAO WEI CHUNG·Filed 2012·Granted Aug 5, 2014·1 cites·10 claims
- 0253US9112063B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 0348US10224243B2Method of fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Mar 5, 2019·0 cites·11 claims
- 0446US9805979B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 31, 2017·0 cites·5 claims
- 0545US9905546B2Package on package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 27, 2018·0 cites·8 claims
- 0645US2018138158A1Fabrication method of package on package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 0737US2013292832A1Semiconductor package and fabrication method thereofTANG SHAO-TZU·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →