Inventor · disambiguated record
Chuehan Hsieh
Also filed as: HSIEH CHUEHAN
5 granted patents·81 citations·filing 2009–2017
80Inventor score
Top patents by PatentIndex Score
5 records- 0192US9484307B2Fan-out wafer level packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Nov 1, 2016·10 cites·18 claims
- 0292US8193647B2Semiconductor device package with an alignment markHSIEH CHUEHAN·Filed 2010·Granted Jun 5, 2012·46 cites·17 claims
- 0390US8358001B2Semiconductor device packages, redistribution structures, and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Jan 22, 2013·23 cites·20 claims
- 0476US9711426B2Fan-out wafer level packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jul 18, 2017·2 cites·16 claims
- 0554US10418299B2Fan-out wafer level packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 17, 2019·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →