Inventor · disambiguated record
Chia-Wen Chiang
Also filed as: CHIANG CHIA-WEN
9 granted patents·2 pending applications·84 citations·filing 2005–2021
86Inventor score
Top patents by PatentIndex Score
11 records- 0194US7663231B2Image sensor module with a three-dimensional die-stacking structureIND TECH RES INST·Filed 2008·Granted Feb 16, 2010·52 cites·9 claims
- 0286US10943938B2Image sensor and manufacturing method thereofIND TECH RES INST·Filed 2018·Granted Mar 9, 2021·4 cites·6 claims
- 0381US10458893B2Miniaturized particulate matter detector and manufacturing method of a filterIND TECH RES INST·Filed 2016·Granted Oct 29, 2019·2 cites·14 claims
- 0481US7960773B2Capacitor device and method for manufacturing the sameIND TECH RES INST·Filed 2009·Granted Jun 14, 2011·11 cites·7 claims
- 0579US7638875B2Packaging structureIND TECH RES INST·Filed 2007·Granted Dec 29, 2009·9 cites·12 claims
- 0670US7851322B2Fabricating method of packaging structureIND TECH RES INST·Filed 2009·Granted Dec 14, 2010·4 cites·18 claims
- 0759US11508772B2Image sensor and manufacturing method thereofIND TECH RES INST·Filed 2021·Granted Nov 22, 2022·0 cites·7 claims
- 0859US7339196B2Packaging of SMD light emitting diodesIND TECH RES INST·Filed 2005·Granted Mar 4, 2008·2 cites·12 claims
- 0950US2009011545A1Chip package processIND TECH RES INST·Filed 2008·Application pending·0 cites
- 1045US2007152318A1Structure and process of chip packageCHIANG CHIA-WEN·Filed 2006·Application pending·0 cites
- 1143US10121673B2Miniaturize particulate matter detector and manufacturing method of a filterIND TECH RES INST·Filed 2015·Granted Nov 6, 2018·0 cites·10 claims
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