Inventor · disambiguated record
How T. Lin
Also filed as: LIN HOW · LIN HOW T · LIN HOW TZU
47 granted patents·2 pending applications·1,322 citations·filing 1992–2012
98Inventor score
Files withIBM23ENDICOTT INTERCONNECT TECH INC19DAS RABINDRA N2MARKOVICH VOYA R2ENDICOTT INTERCONECT TECHNOLOG1
Top patents by PatentIndex Score
49 records- 0198US7292055B2Interposer for use with test apparatusENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Nov 6, 2007·66 cites·9 claims
- 0297US5315227ASolar recharge station for electric vehiclesPIERSON MARK V·Filed 1993·Granted May 24, 1994·340 cites·10 claims
- 0396US6712527B1Fiber optic connections and method for using sameIBM·Filed 2000·Granted Mar 30, 2004·100 cites·23 claims
- 0494US7738249B2Circuitized substrate with internal cooling structure and electrical assembly utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 15, 2010·32 cites·22 claims
- 0592US7841741B2LED lighting assembly and lamp utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Nov 30, 2010·54 cites·20 claims
- 0692US6741778B1Optical device with chip level precision alignmentIBM·Filed 2000·Granted May 25, 2004·56 cites·17 claims
- 0792US6721187B2Multi-layered high density connectionsIBM·Filed 2001·Granted Apr 13, 2004·81 cites·9 claims
- 0891US8607445B1Substrate having internal capacitor and method of making sameDAS RABINDRA N·Filed 2012·Granted Dec 17, 2013·12 cites·19 claims
- 0991US6828514B2High speed circuit board and method for fabricationENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Dec 7, 2004·47 cites·17 claims
- 1091US6635866B2Multi-functional fiber optic couplerIBM·Filed 2001·Granted Oct 21, 2003·51 cites·23 claims
- 1190US6234687B1Self-aligning method and interlocking assembly for attaching an optoelectronic device to a couplerIBM·Filed 1999·Granted May 22, 2001·95 cites·18 claims
- 1289US7541058B2Method of making circuitized substrate with internal optical pathwayENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 2, 2009·20 cites·18 claims
- 1389US7511518B2Method of making an interposerENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Mar 31, 2009·14 cites·10 claims
- 1488US7441709B2Electronic card assemblyENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Oct 28, 2008·22 cites·15 claims
- 1588US7142121B2Radio frequency device for tracking goodsENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Nov 28, 2006·83 cites·8 claims
- 1687US7429510B2Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Sep 30, 2008·15 cites·16 claims
- 1785US7544527B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2006·Granted Jun 9, 2009·12 cites·3 claims
- 1884US7713767B2Method of making circuitized substrate with internal optical pathway using photolithographyENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted May 11, 2010·13 cites·13 claims
- 1981US7449381B2Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2006·Granted Nov 11, 2008·10 cites·19 claims
- 2079US5290992AApparatus for maximizing light beam utilizationIBM·Filed 1992·Granted Mar 1, 1994·35 cites·21 claims
- 2178US7326643B2Method of making circuitized substrate with internal organic memory deviceENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Feb 5, 2008·6 cites·8 claims
- 2277US7629559B2Method of improving electrical connections in circuitized substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Dec 8, 2009·7 cites·16 claims
- 2376US6712261B2Solid conductive element insertion apparatusIBM·Filed 2002·Granted Mar 30, 2004·25 cites·20 claims
- 2475US7897877B2Capacitive substrateENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 1, 2011·5 cites·11 claims
- 2572US7152319B2Method of making high speed circuit boardENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Dec 26, 2006·12 cites·12 claims
- 2670US8501575B2Method of forming multilayer capacitors in a printed circuit substrateDAS RABINDRA N·Filed 2010·Granted Aug 6, 2013·2 cites·4 claims
- 2770US7084496B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2004·Granted Aug 1, 2006·14 cites·18 claims
- 2870US7045897B2Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted May 16, 2006·14 cites·29 claims
- 2969US6580494B1Method and system of distortion compensation in a projection imaging expose systemIBM·Filed 2002·Granted Jun 17, 2003·10 cites·18 claims
- 3069US6527457B2Optical fiber guide module and a method for making the sameIBM·Filed 2001·Granted Mar 4, 2003·11 cites·18 claims
- 3161US6814503B2Fiber optic assemblyIBM·Filed 2002·Granted Nov 9, 2004·6 cites·7 claims
- 3260US6471419B1Fiber optic assemblyIBM·Filed 1999·Granted Oct 29, 2002·20 cites·5 claims
- 3359US7803688B2Capacitive substrate and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2009·Granted Sep 28, 2010·1 cites·10 claims
- 3458US7108809B2Optical coupler replication arrangement and processIBM·Filed 2002·Granted Sep 19, 2006·2 cites·18 claims
- 3553US6580491B2Apparatus and method for compensating for distortion of a printed circuit workpiece substrateIBM·Filed 2000·Granted Jun 17, 2003·5 cites·17 claims
- 3652US7128472B2Method and apparatus for providing optoelectronic communication with an electronic deviceIBM·Filed 2003·Granted Oct 31, 2006·3 cites·15 claims
- 3750US7130522B2Method and structure for two-dimensional optical fiber ferruleIBM·Filed 2004·Granted Oct 31, 2006·2 cites·12 claims
- 3850US6827505B2Optoelectronic package structure and process for planar passive optical and optoelectronic devicesIBM·Filed 2002·Granted Dec 7, 2004·4 cites·20 claims
- 3949US7253502B2Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Aug 7, 2007·2 cites·22 claims
- 4048US2008248596A1Method of making a circuitized substrate having at least one capacitor thereinENDICOTT INTERCONNECT TECH INC·Filed 2007·Application pending·0 cites
- 4146US6982387B2Method and apparatus to establish circuit layers interconnectionsIBM·Filed 2001·Granted Jan 3, 2006·2 cites·5 claims
- 4245US7552091B2Method and system for tracking goodsENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Jun 23, 2009·1 cites·1 claims
- 4343US6657219B2Optical detection and measurement systemIBM·Filed 2001·Granted Dec 2, 2003·2 cites·16 claims
- 4443US2012260063A1Modular, detachable compute leaf for use with computing systemMARKOVICH VOYA R·Filed 2011·Application pending·0 cites
- 4541US8240031B2Method of joining a semiconductor device/chip to a printed wiring boardMARKOVICH VOYA R·Filed 2010·Granted Aug 14, 2012·0 cites·16 claims
- 4640US6651013B1Method and apparatus for determining the location of a short in an electrical wire networkIBM·Filed 2000·Granted Nov 18, 2003·1 cites·45 claims
- 4739US6644864B2Stacked optical couplerIBM·Filed 2002·Granted Nov 11, 2003·0 cites·19 claims
- 4839US6454469B1Actively aligned optical coupling assemblyIBM·Filed 1999·Granted Sep 24, 2002·7 cites·9 claims
- 4931US8198739B2Semi-conductor chip with compressible contact structure and electronic package utilizing sameLIN HOW·Filed 2010·Granted Jun 12, 2012·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →