Inventor · disambiguated record
Yukio Nishida
Also filed as: NISHIDA YUKIO
23 granted patents·15 pending applications·307 citations·filing 1986–2020
95Inventor score
Files withMITSUBISHI ELECTRIC CORP10RENESAS TECH CORP7RENESAS ELECTRONICS CORP5NEC SOLUTION INNOVATORS LTD3BROTHER IND LTD2
Top patents by PatentIndex Score
38 records- 0193US6461934B2Method of manufacturing semiconductor device having trench type element isolation regionsMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 8, 2002·89 cites·6 claims
- 0291US6740939B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted May 25, 2004·61 cites·4 claims
- 0383US4722288ASewing machineBROTHER IND LTD·Filed 1986·Granted Feb 2, 1988·15 cites·17 claims
- 0482US6335252B1Semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jan 1, 2002·31 cites·18 claims
- 0574US9245921B2Semiconductor device including image pick up deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jan 26, 2016·2 cites·7 claims
- 0667US6600195B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 29, 2003·11 cites·8 claims
- 0765US6344388B1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Feb 5, 2002·24 cites·16 claims
- 0864US6223664B1Buttonhole sewing machineBROTHER KABUSHIKI KAISHA·Filed 2000·Granted May 1, 2001·6 cites·24 claims
- 0963US9379150B2Solid-state image sensing device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 28, 2016·0 cites·8 claims
- 1063US6518625B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Feb 11, 2003·28 cites·7 claims
- 1163US4712497ASewing machineBROTHER IND LTD·Filed 1986·Granted Dec 15, 1987·8 cites·4 claims
- 1262US11462556B2Semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 1355US8796780B2Semiconductor device and manufacturing method thereofYAMAMOTO YOSHIKI·Filed 2009·Granted Aug 5, 2014·1 cites·2 claims
- 1455US6576965B2Semiconductor device with lightly doped drain layerMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 10, 2003·21 cites·5 claims
- 1554US10840257B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Nov 17, 2020·0 cites·7 claims
- 1654US9780232B2Memory semiconductor device with peripheral circuit multi-layer conductive film gate electrode and method of manufactureRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 3, 2017·0 cites·12 claims
- 1753US9287259B2Semiconductor integrated circuit device and method for manufacturing semiconductor integrated circuit deviceSHINOHARA HIROFUMI·Filed 2012·Granted Mar 15, 2016·1 cites·2 claims
- 1852US2016052364A1Vehicular air conditionerMITSUBISHI ELECTRIC CORP·Filed 2013·Application pending·0 cites
- 1950US9299854B2Patterning a conductive film in a manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·0 cites·16 claims
- 2050US6812536B2MOSFET with graded gate oxide layerRENESAS TECH CORP·Filed 2003·Granted Nov 2, 2004·5 cites·10 claims
- 2150US6506651B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jan 14, 2003·2 cites·15 claims
- 2248US2008308869A1Semiconductor device which has mos structure and method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 2347US2016099286A1Semiconductor device including image pick up deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2446US2008113480A1Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 2546US2012193726A1Semiconductor device and method of manufacturing the sameYAMASHITA TOMOHIRO·Filed 2009·Application pending·0 cites
- 2644US6864128B2Manufacturing method for a semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Mar 8, 2005·2 cites·5 claims
- 2744US2007007602A1Semiconductor device which has MOS structure and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 2843US2017032349A1Information processing apparatusNEC SOLUTION INNOVATORS LTD·Filed 2015·Application pending·0 cites
- 2937US9842766B2Semiconductor device and method for fabricating semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Dec 12, 2017·0 cites·16 claims
- 3037US6872628B2Method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Mar 29, 2005·0 cites·15 claims
- 3137US2017038912A1Information providing deviceNEC SOLUTION INNOVATORS LTD·Filed 2015·Application pending·0 cites
- 3237US2007111427A1Semiconductor device and method of manufacturing the sameYAMASHITA TOMOHIRO·Filed 2006·Application pending·0 cites
- 3335US2002158303A1Semiconductor device and method of fabricating sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 3434US2003151098A1Semiconductor device having dual-gate structure and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 3533US2017195881A1Information processing system, control method, and program storage mediumNEC SOLUTION INNOVATORS LTD·Filed 2015·Application pending·0 cites
- 3633US2017193204A1Control device, control method therefor, and computer-readable recording mediumNEC SOLUTON INNOVATORS LTD·Filed 2015·Application pending·0 cites
- 3730US2002006706A1Semiconductor device and method of manufacturing seciconductor deviceFiled 1999·Application pending·0 cites
- 3830US2016078940A1Nonvolatile semiconductor memory device and method of manufacturing nonvolatile semiconductor memory deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →