Inventor · disambiguated record
Jaegwon Jang
Also filed as: JANG JAEGWON
28 granted patents·15 pending applications·26 citations·filing 2013–2025
93Inventor score
Top patents by PatentIndex Score
43 records- 0196US11616051B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 28, 2023·4 cites·20 claims
- 0296US11610785B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·4 cites·20 claims
- 0394US11869775B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 9, 2024·2 cites·20 claims
- 0493US11145611B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 12, 2021·3 cites·19 claims
- 0592US12170251B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 17, 2024·2 cites·20 claims
- 0692US11901276B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 13, 2024·1 cites·20 claims
- 0792US11810915B2Semiconductor package with redistribution substrate having embedded passive deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 7, 2023·2 cites·20 claims
- 0888US11456241B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 27, 2022·2 cites·18 claims
- 0981US10879292B2Semiconductor package and method of manufacturing the sameJANG JAEGWON·Filed 2019·Granted Dec 29, 2020·4 cites·20 claims
- 1076US2025070038A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1174US12394700B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 1273US2024312886A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1371US12087744B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·19 claims
- 1471US11869835B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 1571US2024021608A1Semiconductor package with redistribution substrate having embedded passive deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1668US2024170408A1Semiconductor package with stepped redistribution structure exposing mold layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1767US12015018B2Semiconductor package with multiple redistribution substratesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·9 claims
- 1867US11637081B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 1966US2025192016A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2065US9373574B2Semiconductor packages and methods of forming the sameJANG AE-NEE·Filed 2013·Granted Jun 21, 2016·2 cites·13 claims
- 2163US12261106B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·19 claims
- 2263US12014975B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 2362US11804427B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·11 claims
- 2461US12453204B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 21, 2025·0 cites·17 claims
- 2561US11538798B2Semiconductor package with multiple redistribution substratesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·18 claims
- 2660US12300625B2Semiconductor package including outer conductive plateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 2760US11569157B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·18 claims
- 2859US11887931B2Semiconductor package with stepped redistribution structure exposing mold layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·18 claims
- 2958US2025105178A1Semiconductor chip and semiconductor package including the same, and manufacturing method of semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3058US2025157867A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3157US2025167135A1Semiconductor package including a stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3255US2024312974A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3354US2024088055A1Semiconductor package including alignment marksSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3454US2024096815A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3554US2023422521A1Stack-type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3652US2023026972A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3750US11955499B2Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distanceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 3850US9364914B2Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ballSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 14, 2016·0 cites·10 claims
- 3947US2023071812A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4045US11094636B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·16 claims
- 4145US9818703B2Printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 14, 2017·0 cites·20 claims
- 4245US2021020505A1Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4342US8922007B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →