Inventor · disambiguated record
Ponnusamy Palanisamy
Also filed as: PALANISAMY PONNUSAMY
31 granted patents·6 pending applications·938 citations·filing 1981–2020
98Inventor score
Top patents by PatentIndex Score
37 records- 0197US7592276B2Woven electronic textile, yarn and articleSARNOFF CORP·Filed 2003·Granted Sep 22, 2009·133 cites·12 claims
- 0296US7221768B2Hearing aid with large diaphragm microphone element including a printed circuit boardSARNOFF CORP·Filed 2006·Granted May 22, 2007·54 cites·8 claims
- 0396US7003127B1Hearing aid with large diaphragm microphone element including a printed circuit boardSARNOFF CORP·Filed 2000·Granted Feb 21, 2006·155 cites·4 claims
- 0493US4797605AMoisture sensor and method of fabrication thereofDELCO ELECTRONICS CORP·Filed 1987·Granted Jan 10, 1989·60 cites·2 claims
- 0592US6653009B2Solid oxide fuel cells and interconnectorsSARNOFF CORP·Filed 2002·Granted Nov 25, 2003·47 cites·36 claims
- 0689US6366678B1Microphone assembly for hearing aid with JFET flip-chip bufferSARNOFF CORP·Filed 2000·Granted Apr 2, 2002·37 cites·9 claims
- 0782US4939022AElectrical conductorsDELCO ELECTRONICS CORP·Filed 1989·Granted Jul 3, 1990·56 cites·6 claims
- 0881US5121298AControlled adhesion conductorDELCO ELECTRONICS CORP·Filed 1990·Granted Jun 9, 1992·49 cites·10 claims
- 0980US5151777AInterface device for thermally coupling an integrated circuit to a heat sinkDELCO ELECTRONICS CORP·Filed 1989·Granted Sep 29, 1992·61 cites·6 claims
- 1079US6939737B2Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit boardSARNOFF CORP·Filed 2004·Granted Sep 6, 2005·19 cites·19 claims
- 1179US5395679AUltra-thick thick films for thermal management and current carrying capabilities in hybrid circuitsDELCO ELECTRONICS CORP·Filed 1993·Granted Mar 7, 1995·65 cites·13 claims
- 1278US5176853AControlled adhesion conductorDELCO ELECTRONICS CORP·Filed 1989·Granted Jan 5, 1993·33 cites·7 claims
- 1374US6849935B2Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit boardSARNOFF CORP·Filed 2003·Granted Feb 1, 2005·14 cites·19 claims
- 1470USRE42542ELow-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit boardTRANSPACIFIC INFINITY LLC·Filed 2007·Granted Jul 12, 2011·2 cites·51 claims
- 1570US4970122AMoisture sensor and method of fabrication thereofDELCO ELECTRONICS CORP·Filed 1989·Granted Nov 13, 1990·27 cites·12 claims
- 1666US4846869AMethod of fabrication a curved glass sheet with a conductive oxide coatingDELCO ELECTRONICS CORP·Filed 1988·Granted Jul 11, 1989·20 cites·9 claims
- 1765USRE41914EThermal management in electronic displaysPALANISAMY PONNUSAMY·Filed 2007·Granted Nov 9, 2010·2 cites·50 claims
- 1859US4847003AElectrical conductorsDELCO ELECTRONICS CORP·Filed 1988·Granted Jul 11, 1989·22 cites·11 claims
- 1958US4452726ASelf-sealing thermally sensitive resistor and method of making sameGEN MOTORS CORP·Filed 1981·Granted Jun 5, 1984·11 cites·7 claims
- 2056US6743069B2Facilitating the spread of encapsulant between surfaces of electronic devicesINTEL CORP·Filed 2001·Granted Jun 1, 2004·7 cites·13 claims
- 2155US6527159B2Surface mounting to an irregular surfaceINTEL CORP·Filed 2001·Granted Mar 4, 2003·6 cites·5 claims
- 2254US5169679APost-termination apparatus and process for thick film resistors of printed circuit boardsDELCO ELECTRONICS CORP·Filed 1988·Granted Dec 8, 1992·8 cites·8 claims
- 2354US5122929AMethod of achieving selective inhibition and control of adhesion in thick-film conductorsDELCO ELECTRONICS CORP·Filed 1989·Granted Jun 16, 1992·19 cites·40 claims
- 2452USRE41669ELow-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit boardPALANISAMY PONNUSAMY·Filed 2007·Granted Sep 14, 2010·0 cites·48 claims
- 2551US6512301B1Making interconnections to a non-flat surfaceINTEL CORP·Filed 2001·Granted Jan 28, 2003·3 cites·5 claims
- 2651US2007121967A1Hearing aid with large diaphragm microphone element including a printed circuit boardSJURSEN WALTER P·Filed 2006·Application pending·0 cites
- 2749US6914379B2Thermal management in electronic displaysSARNOFF CORP·Filed 2003·Granted Jul 5, 2005·1 cites·20 claims
- 2847US6706556B2Making interconnections to a non-flat surfaceINTEL CORP·Filed 2002·Granted Mar 16, 2004·2 cites·15 claims
- 2947US5164698APost-termination apparatus and process for thick film resistors of printed circuit boardsDELCO ELECTRONICS CORP·Filed 1991·Granted Nov 17, 1992·10 cites·6 claims
- 3045US2002090102A1Microphone assembly for hearing aid with JFET flip-chip bufferSARNOFF CORP·Filed 2002·Application pending·0 cites
- 3142US7002562B2Interconnecting large area display panelsINTEL CORP·Filed 2001·Granted Feb 21, 2006·0 cites·10 claims
- 3241US2022225501A1Conductive thick film paste for silicon nitride and other substratesFERRO CORP·Filed 2019·Application pending·0 cites
- 3341US2022238261A1High Adhesion Resistive CompositionFERRO CORP·Filed 2020·Application pending·0 cites
- 3440US4959751ACeramic hybrid integrated circuit having surface mount device solder stress reductionDELCO ELECTRONICS CORP·Filed 1989·Granted Sep 25, 1990·10 cites·4 claims
- 3539US2003132702A1Passivating organic light emitting devicesFiled 2003·Application pending·0 cites
- 3638US2003011300A1Passivating organic light emitting devicesFiled 2001·Application pending·0 cites
- 3734US4819056AHybrid thick film circuit deviceDELCO ELECTRONICS CORP·Filed 1987·Granted Apr 4, 1989·5 cites·6 claims
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