Inventor · disambiguated record
Guido Knippels
Also filed as: KNIPPELS GUIDO · KNIPPELS GUIDO MARTINUS HENRICUS
12 granted patents·7 pending applications·152 citations·filing 2001–2017
89Inventor score
Files withASM TECH SINGAPORE PTE LTD5BLUELEAF INC2ADVANCED LASER SEPARATION INT (ALSI) N V1ADVANCED LASER SEPARATIONINTERNAT ALSI N V1ERNST FRANK1
Top patents by PatentIndex Score
19 records- 0193US6611546B1Optical transmitter comprising a stepwise tunable laserBLUELEAF INC·Filed 2001·Granted Aug 26, 2003·67 cites·20 claims
- 0292US6711203B1Optical transmitter comprising a stepwise tunable laserBLUELEAF INC·Filed 2002·Granted Mar 23, 2004·50 cites·13 claims
- 0387US10493559B2Method and apparatus for laser machiningSTRAW MARCUS·Filed 2009·Granted Dec 3, 2019·10 cites·20 claims
- 0481US8569712B2Beam blanker for interrupting a beam of charged particlesKNIPPELS GUIDO MARTINUS HENRICUS·Filed 2011·Granted Oct 29, 2013·10 cites·23 claims
- 0580US9312178B2Method of dicing thin semiconductor substratesASM TECH SINGAPORE PTE LTD·Filed 2015·Granted Apr 12, 2016·6 cites·15 claims
- 0671US10340170B2Method and device for grooving wafersASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Jul 2, 2019·2 cites·17 claims
- 0761US10096498B2Adjustable spatial filter for laser scribing apparatusASM TECH SINGAPORE PTE LTD·Filed 2014·Granted Oct 9, 2018·2 cites·9 claims
- 0860US10307867B2Laser fiber array for singulating semiconductor wafersHOLLINGER FRANZ·Filed 2014·Granted Jun 4, 2019·3 cites·11 claims
- 0960US8785298B2Method of singulating a thin semiconductor waferADVANCED LASER SEPARATIONINTERNAT ALSI N V·Filed 2013·Granted Jul 22, 2014·2 cites·10 claims
- 1041US2006083284A1Method for increasing the dynamic range of a cavity enhanced optical spectrometerPALDUS BARBARA·Filed 2004·Application pending·0 cites
- 1141US2004165641A1Optical transmitter comprising a stepwise tunable laserFiled 2004·Application pending·0 cites
- 1240US2006132766A1Continuously tunable external cavity diode laserRICHMAN BRUCE·Filed 2004·Application pending·0 cites
- 1339US2005168826A1Method and apparatus for adjusting the path of an optical beamFiled 2004·Application pending·0 cites
- 1438US2005168825A1Method and apparatus for adjusting the path of an optical beamFiled 2004·Application pending·0 cites
- 1537US9449877B2Method of protecting a mounting tape during laser singulation of a waferERNST FRANK·Filed 2014·Granted Sep 20, 2016·0 cites·16 claims
- 1634US2006233206A1Frequency doubling crystal and frequency doubled external cavity laserMINER CARLA·Filed 2005·Application pending·0 cites
- 1731US2018311762A1Substrate cutting control and inspectionASM TECH SINGAPORE PTE LTD·Filed 2017·Application pending·0 cites
- 1828US10134650B2Apparatus and method for cutting a wafer that is substantially covered by an opaque materialASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Nov 20, 2018·0 cites·5 claims
- 1925US9592574B2Method and apparatus for scribing a substantially planar semiconductor substrate with on-the-fly control of scribing alignmentADVANCED LASER SEPARATION INT (ALSI) N V·Filed 2013·Granted Mar 14, 2017·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →