Inventor · disambiguated record
Kaushik Chattopadhyay
Also filed as: CHATTOPADHYAY KAUSHIK
13 granted patents·1 pending application·889 citations·filing 2007–2017
93Inventor score
Top patents by PatentIndex Score
14 records- 0198US7727880B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jun 1, 2010·332 cites·19 claims
- 0297US9881788B2Back side deposition apparatus and applicationsLAM RES CORP·Filed 2014·Granted Jan 30, 2018·372 cites·9 claims
- 0397US7576006B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Aug 18, 2009·55 cites·19 claims
- 0494US8021486B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2010·Granted Sep 20, 2011·14 cites·18 claims
- 0593US8173537B1Methods for reducing UV and dielectric diffusion barrier interactionCHATTOPADHYAY KAUSHIK·Filed 2007·Granted May 8, 2012·31 cites·21 claims
- 0691US7704873B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Apr 27, 2010·14 cites·27 claims
- 0789US8124522B1Reducing UV and dielectric diffusion barrier interaction through the modulation of optical propertiesWU HUI-JUNG·Filed 2008·Granted Feb 28, 2012·31 cites·10 claims
- 0889US7727881B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jun 1, 2010·17 cites·30 claims
- 0987US8430992B1Protective self-aligned buffer layers for damascene interconnectsCHATTOPADHYAY KAUSHIK·Filed 2010·Granted Apr 30, 2013·9 cites·17 claims
- 1086US8317923B1Protective self-aligned buffer layers for damascene interconnectsCHATTOPADHYAY KAUSHIK·Filed 2010·Granted Nov 27, 2012·8 cites·20 claims
- 1185US9018103B2High aspect ratio etch with combination maskLAM RES CORP·Filed 2013·Granted Apr 28, 2015·5 cites·16 claims
- 1267US9659783B2High aspect ratio etch with combination maskLAM RES CORP·Filed 2015·Granted May 23, 2017·1 cites·16 claims
- 1346US10242883B2High aspect ratio etch of oxide metal oxide metal stackLAM RES CORP·Filed 2017·Granted Mar 26, 2019·0 cites·18 claims
- 1439US2013323930A1Selective Capping of Metal Interconnect Lines during Air Gap FormationCHATTOPADHYAY KAUSHIK·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →