Inventor · disambiguated record
Steven G. Rosser
Also filed as: ROSSER STEVEN G
8 granted patents·1 pending application·83 citations·filing 2002–2010
87Inventor score
Top patents by PatentIndex Score
9 records- 0188US7791897B2Multi-layer embedded capacitance and resistance substrate coreENDICOTT INTERCONNECT TECH INC·Filed 2008·Granted Sep 7, 2010·15 cites·14 claims
- 0282US7294791B2Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Granted Nov 13, 2007·30 cites·10 claims
- 0381US7589283B2Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling systemENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Sep 15, 2009·12 cites·19 claims
- 0468US6747331B2Method and packaging structure for optimizing warpage of flip chip organic packagesIBM·Filed 2002·Granted Jun 8, 2004·13 cites·5 claims
- 0566US8144480B2Multi-layer embedded capacitance and resistance substrate coreDAS RABINDRA N·Filed 2010·Granted Mar 27, 2012·2 cites·6 claims
- 0665US7351917B2Vents with signal image for signal return pathIBM·Filed 2005·Granted Apr 1, 2008·2 cites·17 claims
- 0758US6977345B2Vents with signal image for signal return pathIBM·Filed 2002·Granted Dec 20, 2005·6 cites·11 claims
- 0849US7026706B2Method and packaging structure for optimizing warpage of flip chip organic packagesIBM·Filed 2004·Granted Apr 11, 2006·3 cites·10 claims
- 0949US2008127485A1Vents with signal image for signal return pathBUDELL TIMOTHY W·Filed 2008·Application pending·0 cites
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