Inventor · disambiguated record
Reimar Heucher
Also filed as: HEUCHER REIMAR
17 granted patents·2 pending applications·546 citations·filing 1991–2018
95Inventor score
Top patents by PatentIndex Score
19 records- 0193US6221978B1Moisture curable hot melt adhesive and method for bonding substrates using sameHENKEL CORP·Filed 1999·Granted Apr 24, 2001·110 cites·110 claims
- 0290US5807968APolyamide compositions and related methodsHENKEL CORP·Filed 1996·Granted Sep 15, 1998·71 cites·45 claims
- 0386US5548027AHotmelt adhesiveHENKEL KGAA·Filed 1993·Granted Aug 20, 1996·49 cites·24 claims
- 0485US5719255APolyamide based on dimer fatty acidHENKEL KGAA·Filed 1995·Granted Feb 17, 1998·71 cites·24 claims
- 0584US10590310B2Electrical debonding of PU hot melt adhesives by use of conductive inksHENKEL AG & CO KGAA·Filed 2018·Granted Mar 17, 2020·1 cites·16 claims
- 0683US5804682AAqueous dispersions of polyamidesHENKEL CORP·Filed 1996·Granted Sep 8, 1998·46 cites·68 claims
- 0781US10800956B2Debondable reactive hot melt adhesivesHENKEL AG & CO KGAA·Filed 2017·Granted Oct 13, 2020·2 cites·16 claims
- 0876US5902849AFilling compoundHENKEL KGAA·Filed 1996·Granted May 11, 1999·33 cites·31 claims
- 0975US6077900AAqueous polyamide dispersion compositionCOGNIS CORP·Filed 1998·Granted Jun 20, 2000·32 cites·3 claims
- 1070US5412022ALyo gel, its production and its use for sealingHENKEL KGAA·Filed 1991·Granted May 2, 1995·17 cites·19 claims
- 1163US5723538AAqueous dispersions of polyamidesHENKEL CORP·Filed 1996·Granted Mar 3, 1998·20 cites·56 claims
- 1258US2014374032A1Electrically divisible polyamide adhesiveHENKEL AG & CO KGAA·Filed 2014·Application pending·0 cites
- 1355US5510405APlug-type connector for coaxial cablesHENKEL KGAA·Filed 1992·Granted Apr 23, 1996·20 cites·20 claims
- 1451US6258885B1Filling compoundHENKEL KGAA·Filed 1999·Granted Jul 10, 2001·12 cites·33 claims
- 1551US5519109AMoisture-curing polyamidesHENKEL KGAA·Filed 1995·Granted May 21, 1996·18 cites·21 claims
- 1650US5770680AAqueous dispersions of polyamidesFiled 1996·Granted Jun 23, 1998·17 cites·67 claims
- 1749US5883172APolyamide hotmelt adhesiveHENKEL KGAA·Filed 1997·Granted Mar 16, 1999·16 cites·20 claims
- 1848US5922831AMethod of manufacturing an upper for a shoeFiled 1998·Granted Jul 13, 1999·11 cites·20 claims
- 1945US2017158909A1Polyamide Hot Melt CoatingHENKEL AG & CO KGAA·Filed 2017·Application pending·0 cites
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