Inventor · disambiguated record
Yu-Hao Liu
Also filed as: LIU YU · Liu yu-hao
9 granted patents·5 pending applications·13 citations·filing 2016–2025
81Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7FARADAY TECH CORP3CADENCE DESIGN SYSTEMS INC2HEWLETT PACKARD DEVELOPMENT CO1UNIV COLORADO REGENTS1
Top patents by PatentIndex Score
14 records- 0193US11342904B1D flip-flopFARADAY TECH CORP·Filed 2021·Granted May 24, 2022·4 cites·5 claims
- 0292US12113051B2Die to die interface circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·1 cites·18 claims
- 0390US11515862B2D flip-flopFARADAY TECH CORP·Filed 2022·Granted Nov 29, 2022·2 cites·22 claims
- 0485US11658158B2Die to die interface circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·1 cites·20 claims
- 0584US2025363274A1Integrated circuit design system, method and computer program productTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0682US10402530B1Method, system, and computer program product for implementing placement using row templates for an electronic designCADENCE DESIGN SYSTEMS INC·Filed 2016·Granted Sep 3, 2019·5 cites·20 claims
- 0778US2024387471A1Die to die interface circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0877US2025232101A1Integrated circuit design system, method and computer program productTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0970US11689190B2D flip-flopFARADAY TECH CORP·Filed 2022·Granted Jun 27, 2023·0 cites·3 claims
- 1064US2025372589A1System Including an Active Interposer and Method for Manufacturing the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1151US11790147B1System and method for routing in an electronic designCADENCE DESIGN SYSTEMS INC·Filed 2021·Granted Oct 17, 2023·0 cites·18 claims
- 1251US11154232B2Mechano-acoustic sensing devices and methodsUNIV COLORADO REGENTS·Filed 2018·Granted Oct 26, 2021·0 cites·12 claims
- 1351US2025165691A1Method of designing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1440US11223392B2Radio module configurations for antennasHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jan 11, 2022·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →