Inventor · disambiguated record
Kamran Manteghi
Also filed as: MANTEGHI KAMRAN
16 granted patents·3 pending applications·1,014 citations·filing 1995–2023
96Inventor score
Files withVLSI TECHNOLOGY INC12PHILIPS ELECTRONICS NA3GRIDTENTIAL ENERGY INC1MOSLEHI MEHRDAD M1SOLEXEL INC1
Top patents by PatentIndex Score
19 records- 0196US5646831AElectrically enhanced power quad flat pack arrangementVLSI TECHNOLOGY INC·Filed 1995·Granted Jul 8, 1997·239 cites·7 claims
- 0294US5689091AMulti-layer substrate structureVLSI TECHNOLOGY INC·Filed 1996·Granted Nov 18, 1997·201 cites·22 claims
- 0389US5854512AHigh density leaded ball-grid array packageVLSI TECHNOLOGY INC·Filed 1996·Granted Dec 29, 1998·98 cites·11 claims
- 0487US5710695ALeadframe ball grid array packageVLSI TECHNOLOGY INC·Filed 1995·Granted Jan 20, 1998·97 cites·14 claims
- 0582US6177726B1SiO2 wire bond insulation in semiconductor assembliesPHILIPS ELECTRONICS NA·Filed 1999·Granted Jan 23, 2001·69 cites·8 claims
- 0679US5847455AMolded leadframe ball grid arrayVLSI TECHNOLOGY INC·Filed 1995·Granted Dec 8, 1998·51 cites·10 claims
- 0773US6083776AMolded lead frame ball grid arrayPHILIPS ELECTRONICS NA·Filed 1998·Granted Jul 4, 2000·37 cites·10 claims
- 0872US9842949B2High-efficiency solar photovoltaic cells and modules using thin crystalline semiconductor absorbersMOSLEHI MEHRDAD M·Filed 2012·Granted Dec 12, 2017·2 cites·25 claims
- 0968US6228683B1High density leaded ball-grid array packagePHILIPS ELECTRONICS NA·Filed 1998·Granted May 8, 2001·31 cites·11 claims
- 1068US5796038ATechnique to produce cavity-up HBGA packagesVLSI TECHNOLOGY INC·Filed 1997·Granted Aug 18, 1998·37 cites·8 claims
- 1167US5661337ATechnique for improving bonding strength of leadframe to substrate in semiconductor IC chip packagesVLSI TECHNOLOGY INC·Filed 1995·Granted Aug 26, 1997·35 cites·11 claims
- 1264US6046075AOxide wire bond insulation in semiconductor assembliesVLSI TECHNOLOGY INC·Filed 1997·Granted Apr 4, 2000·26 cites·18 claims
- 1364US5863812AProcess for manufacturing a multi layer bumped semiconductor deviceVLSI TECHNOLOGY INC·Filed 1996·Granted Jan 26, 1999·31 cites·10 claims
- 1461US6033937ASi O2 wire bond insulation in semiconductor assembliesVLSI TECHNOLOGY INC·Filed 1997·Granted Mar 7, 2000·27 cites·16 claims
- 1561US2023246164A1Customizable Current Collector SurfacesGRIDTENTIAL ENERGY INC·Filed 2023·Application pending·0 cites
- 1659US5800958AElectrically enhanced power quad flat pack arrangementVLSI TECHNOLOGY INC·Filed 1997·Granted Sep 1, 1998·21 cites·6 claims
- 1750US2016013335A1Active backplane for thin silicon solar cellsSOLEXEL INC·Filed 2015·Application pending·0 cites
- 1848US6040633AOxide wire bond insulation in semiconductor assembliesVLSI TECHNOLOGY INC·Filed 1999·Granted Mar 21, 2000·12 cites·14 claims
- 1935US2002168799A1Die mounting on a substrateFiled 2001·Application pending·0 cites
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