Inventor · disambiguated record
Chih-Yuan Chang
Also filed as: CHANG CHIH · CHANG CHIH YUAN
58 granted patents·24 pending applications·369 citations·filing 2000–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD25NOVATEK MICROELECTRONICS CORP14FULLTECH FIBER GLASS CORP5ACER INC4HUANG HE-WEI4
Top patents by PatentIndex Score
82 records- 0199US9831148B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·104 cites·20 claims
- 0297US11302649B2Semiconductor device with shielding structure for cross-talk reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·6 cites·20 claims
- 0396US10163852B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·13 cites·20 claims
- 0494US11095065B2Combination structure of socket of power supply deviceCHICONY POWER TECH CO LTD·Filed 2020·Granted Aug 17, 2021·3 cites·10 claims
- 0592US10497668B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·5 cites·20 claims
- 0691US10763164B2Package structure with inductor and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 1, 2020·7 cites·20 claims
- 0790US9893042B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·7 cites·25 claims
- 0889US11503247B1Method of MEMC and related video processorNOVATEK MICROELECTRONICS CORP·Filed 2022·Granted Nov 15, 2022·2 cites·10 claims
- 0987US6893383B1StepperALILIFE IND CO LTD·Filed 2004·Granted May 17, 2005·83 cites·4 claims
- 1086US6733423B1Speed control device of a treadmillALILIFE IND CO LTD·Filed 2003·Granted May 11, 2004·48 cites·4 claims
- 1185US11658134B2Inductor structure, semiconductor package and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·1 cites·20 claims
- 1285US10665560B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 26, 2020·3 cites·18 claims
- 1383US11063016B2Integrated fan-out package including voltage regulators and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·2 cites·20 claims
- 1483US10055049B2Touch sensor system and multiplexer thereofNOVATEK MICROELECTRONICS CORP·Filed 2015·Granted Aug 21, 2018·4 cites·8 claims
- 1582US10269728B2Semiconductor device with shielding structure for cross-talk reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·3 cites·20 claims
- 1682US8415957B2Capacitance measurement circuit and methodHUANG HE-WEI·Filed 2009·Granted Apr 9, 2013·11 cites·22 claims
- 1780US2025022852A1Wafer-level stacked die structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1880US2024321757A1Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1979US10678369B2Touch sensor system and multiplexer thereofNOVATEK MICROELECTRONICS CORP·Filed 2018·Granted Jun 9, 2020·2 cites·35 claims
- 2079US8878555B2Capacitance measurement device for a touch control deviceHUANG HE-WEI·Filed 2011·Granted Nov 4, 2014·5 cites·19 claims
- 2179US7024469B1Medium access control (MAC) protocol with seamless polling/contention modesAVAYA TECHNOLOGY CORP·Filed 2000·Granted Apr 4, 2006·22 cites·39 claims
- 2279US2024363559A1Inductor structure, semiconductor package and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2377US12074122B2Inductor structure, semiconductor package and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·16 claims
- 2477US11195817B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·2 cites·20 claims
- 2576US11094634B2Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 17, 2021·1 cites·20 claims
- 2675US12125826B2Wafer-level stacked die structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 22, 2024·0 cites·15 claims
- 2775US11830841B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 2874US12040281B2Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·20 claims
- 2972US10692817B2Semiconductor device with shielding structure for cross-talk reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 23, 2020·1 cites·20 claims
- 3070USD1062545SElectric bicycleACER INC·Filed 2023·Granted Feb 18, 2025·3 cites·1 claims
- 3168US12199873B2Scalable E2E network architecture and components to support low latency and high throughputAVAGO TECH INT SALES PTE LID·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 3268US11562926B2Package structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 3368US11322470B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 3468US9389738B2Touching apparatus and touching detecting method thereofNOVATEK MICROELECTRONICS CORP·Filed 2013·Granted Jul 12, 2016·2 cites·10 claims
- 3567US11075136B2Heat transfer structures and methods for IC packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·20 claims
- 3666US2025210919A1Power protection componentCHROMA ATE INC·Filed 2024·Application pending·0 cites
- 3766US2025300436A1Power busbar device and power supply deviceCHROMA ATE INC·Filed 2025·Application pending·0 cites
- 3864US2009038492A1Micro-Stamping Method for Photoelectric ProcessUNIV NAT TAIWAN·Filed 2008·Application pending·0 cites
- 3963US9530705B24 port L-2L de-embedding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 27, 2016·1 cites·20 claims
- 4063US7170904B1Adaptive cell scheduling algorithm for wireless asynchronous transfer mode (ATM) systemsAVAYA TECHNOLOGY CORP·Filed 2000·Granted Jan 30, 2007·11 cites·52 claims
- 4162US12113532B2Pseudo resistor with autotune functionNOVATEK MICROELECTRONICS CORP·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 4262US11444059B2Wafer-level stacked die structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 13, 2022·0 cites·17 claims
- 4361US11729099B2Scalable E2E network architecture and components to support low latency and high throughputAVAGO TECH INT SALES PTE LID·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 4460US10559517B2Heat transfer structures and methods for IC packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 4560US8115747B2Energy-efficient touch panel device and related methodCHANG HUI-HUNG·Filed 2009·Granted Feb 14, 2012·2 cites·8 claims
- 4658US8508490B2Method of detecting a touch event for a touch panel and related deviceHUANG HE-WEI·Filed 2009·Granted Aug 13, 2013·1 cites·25 claims
- 4757US9702914B2Capacitance measurement device and electronic device thereofNOVATEK MICROELECTRONICS CORP·Filed 2014·Granted Jul 11, 2017·0 cites·12 claims
- 4857US7085612B2System and method for identifying semiconductor process steps for queue-time control and abnormality detectionTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 1, 2006·8 cites·25 claims
- 4957US2025355269A1Photonic integrated circuit and controlling method thereof for vertical optical computingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5056USD1063712SElectric bicycleACER INC·Filed 2023·Granted Feb 25, 2025·1 cites·1 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
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