Inventor · disambiguated record
Hideki Tateishi
Also filed as: TATEISHI HIDEKI
8 granted patents·4 pending applications·504 citations·filing 1981–2010
89Inventor score
Top patents by PatentIndex Score
12 records- 0197US4610770AMethod and apparatus for sputteringHITACHI LTD·Filed 1984·Granted Sep 9, 1986·86 cites·24 claims
- 0296US4853102ASputtering process and an apparatus for carrying out the sameHITACHI LTD·Filed 1987·Granted Aug 1, 1989·97 cites·24 claims
- 0396US4405435AApparatus for performing continuous treatment in vacuumHITACHI LTD·Filed 1981·Granted Sep 20, 1983·171 cites·12 claims
- 0496US4401539ASputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structureHITACHI LTD·Filed 1982·Granted Aug 30, 1983·90 cites·40 claims
- 0590US4675096AContinuous sputtering apparatusHITACHI LTD·Filed 1984·Granted Jun 23, 1987·58 cites·9 claims
- 0667US7709394B2Substrate processing method and apparatus fabrication process of a semiconductor deviceTOKYO ELECTRON LTD·Filed 2007·Granted May 4, 2010·2 cites·8 claims
- 0751US8357284B2Method for forming metal filmEBARA CORP·Filed 2010·Granted Jan 22, 2013·0 cites·7 claims
- 0848US2009204252A1Substrate processing method and apparatus, method for manufacturing semiconductor device and storage mediumTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 0944US2006118598A1Bonding apparatus and bonding methodEBARA CORP·Filed 2005·Application pending·0 cites
- 1039US8205625B2Apparatus and method for surface treatment of substrate, and substrate processing apparatus and methodTATEISHI HIDEKI·Filed 2007·Granted Jun 26, 2012·0 cites·5 claims
- 1139US2007289604A1Substrate Processing ApparatusFUKUNAGA YUKIO·Filed 2005·Application pending·0 cites
- 1235US2010097607A1Film Thickness Measuring Method and Substrate Processing ApparatusSUSAKI AKIRA·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →