Inventor · disambiguated record
Cheng-Yuan Li
Also filed as: LI CHENG-YUAN
13 granted patents·3 pending applications·21 citations·filing 2014–2025
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16
Top patents by PatentIndex Score
16 records- 0192US10692826B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·8 cites·20 claims
- 0290US10276616B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·8 cites·20 claims
- 0382US9559135B2Conduction layer for stacked CIS charging preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 31, 2017·4 cites·20 claims
- 0481US11456263B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·1 cites·20 claims
- 0575US2025105147A1Low resistance interconnect structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0675US2023387172A1Anchor Structures And Methods For Uniform Wafer Planarization And BondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0772US12199036B2Low resistance interconnect structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 0871US12021054B2Redistribution layer (RDL) layouts for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0968US11817472B2Anchor structures and methods for uniform wafer planarization and bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 1066US12218051B2Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1159US12009323B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 1254US11476191B2Low resistance interconnect structure for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 1353US12068246B2Redistribution layer layouts on integrated circuits and methods for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 20, 2024·0 cites·20 claims
- 1452US11791299B2Redistribution layer (RDL) layouts for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 17, 2023·0 cites·20 claims
- 1549US2025157922A1Method of manufacturing a semiconductor device including a plurality of circuit components and array of conductive contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1647US11152417B2Anchor structures and methods for uniform wafer planarization and bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 19, 2021·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →