Inventor · disambiguated record
Kuan-Hsien Li
Also filed as: LI KUAN · LI KUAN-HSIEN
11 granted patents·2 pending applications·46 citations·filing 1993–2021
85Inventor score
Files withUNITED MICROELECTRONICS CORP9JIANGSU JINGYUAN ENVIRONMENTAL PROT CO LTD1JIANGSU SINOROAD TRANSP SCIENCE AND TECHNOLOGY CO LTD1LI KUAN HSIEN1SINOROAD TRANSP SCIENCE AND TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
13 records- 0193US9524909B2Fin structure and fin structure cutting processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 20, 2016·9 cites·13 claims
- 0288US8951884B1Method for forming a FinFET structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 10, 2015·7 cites·11 claims
- 0378US10633271B2Zero-discharge technique for separating sludge and salt from desulfurization wastewaterJIANGSU JINGYUAN ENVIRONMENTAL PROT CO LTD·Filed 2017·Granted Apr 28, 2020·4 cites·8 claims
- 0475US9786502B2Method for forming fin structures for non-planar semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 10, 2017·2 cites·10 claims
- 0566US5261168AFruit dryerLI KUAN HSIEN·Filed 1993·Granted Nov 16, 1993·24 cites·2 claims
- 0655US2015132966A1Method for forming a finfet structureUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 0754US9859147B2Fin structure cutting processUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 2, 2018·0 cites·13 claims
- 0852US10090398B2Manufacturing method of patterned structure of semiconductorUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 2, 2018·0 cites·5 claims
- 0950US12247143B2Two-stage epoxy bonding oil, preparation method and application thereofSINOROAD TRANSP SCIENCE AND TECHNOLOGY CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·3 claims
- 1050US11155707B2Anti-fatigue cold mixed epoxy resin material, preparation method and application thereofJIANGSU SINOROAD TRANSP SCIENCE AND TECHNOLOGY CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·8 claims
- 1149US9466691B2Fin shaped structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Oct 11, 2016·0 cites·10 claims
- 1248US9755048B2Patterned structure of a semiconductor device and a manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 5, 2017·0 cites·10 claims
- 1333US2016276429A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →