Inventor · disambiguated record
Richard Vreeland
Also filed as: VREELAND RICHARD · VREELAND RICHARD F · VREELAND RICHARD FARRINGTON
15 granted patents·4 pending applications·80 citations·filing 2013–2023
89Inventor score
Top patents by PatentIndex Score
19 records- 0196US9634715B2Signaling between master and slave components using a shared communication node of the master componentALLEGRO MICROSYSTEMS LLC·Filed 2015·Granted Apr 25, 2017·28 cites·44 claims
- 0293US9787495B2Signaling between master and slave components using a shared communication node of the master componentALLEGRO MICROSYSTEMS LLC·Filed 2015·Granted Oct 10, 2017·18 cites·34 claims
- 0393US9400164B2Magnetic field sensor and related techniques that provide an angle correction moduleALLEGRO MICROSYSTEMS LLC·Filed 2013·Granted Jul 26, 2016·15 cites·18 claims
- 0492US10747708B2Communication system between electronic devicesALLEGRO MICROSYSTEMS LLC·Filed 2018·Granted Aug 18, 2020·13 cites·23 claims
- 0585US11328992B2Integrated circuit components with dummy structuresINTEL CORP·Filed 2017·Granted May 10, 2022·4 cites·17 claims
- 0680US11289421B2Methods and structures for improved electrical contact between bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
- 0772US12087836B2Contact over active gate structures with metal oxide-caped contacts to inhibit shortingINTEL CORP·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 0870US11784123B2Methods and structures for improved electrical contact between bonded integrated circuit interfacesINTEL CORP·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 0970US11784121B2Integrated circuit components with dummy structuresINTEL CORP·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 1065US11887887B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·18 claims
- 1157US2025112155A1Conformal coatings with spatially defined surface energies for die-to-wafer self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 1256US2025112218A1Selective layer transfer process improvementsINTEL CORP·Filed 2023·Application pending·0 cites
- 1356US2025105046A1Selective layer transferINTEL CORP·Filed 2023·Application pending·0 cites
- 1455US11837644B2Contact over active gate structures with metal oxide-caped contacts to inhibit shortingINTEL CORP·Filed 2019·Granted Dec 5, 2023·0 cites·19 claims
- 1555US11404307B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2019·Granted Aug 2, 2022·0 cites·18 claims
- 1650US2023187395A1Oxide and carbon layers at a surface of a substrate for hybrid bondingINTEL CORP·Filed 2021·Application pending·0 cites
- 1749US11367684B2Recessed metal interconnects to mitigate EPE-related via shortingINTEL CORP·Filed 2018·Granted Jun 21, 2022·0 cites·14 claims
- 1846US11532558B2Metallization barrier structures for bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
- 1938US11201114B2Methods of forming thin film resistor structures utilizing interconnect liner materialsINTEL CORP·Filed 2016·Granted Dec 14, 2021·0 cites·5 claims
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