Inventor · disambiguated record
Jae Man Park
Also filed as: PARK JAE · PARK JAE M · PARK JAE MAN
57 granted patents·15 pending applications·779 citations·filing 1987–2025
98Inventor score
Top patents by PatentIndex Score
72 records- 0199US5300208AFabrication of printed circuit boards using conducting polymerIBM·Filed 1989·Granted Apr 5, 1994·108 cites·30 claims
- 0294US4969979ADirect electroplating of through holesIBM·Filed 1989·Granted Nov 13, 1990·66 cites·18 claims
- 0392US12248239B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2021·Granted Mar 11, 2025·4 cites·21 claims
- 0490US8941973B2Multilayer ceramic electronic component and method of manufacturing the sameKIM JONG HAN·Filed 2012·Granted Jan 27, 2015·8 cites·20 claims
- 0589US5055342AFluorinated polymeric composition, fabrication thereof and use thereofIBM·Filed 1990·Granted Oct 8, 1991·69 cites·28 claims
- 0688US5232548ADiscrete fabrication of multi-layer thin film, wiring structuresIBM·Filed 1991·Granted Aug 3, 1993·83 cites·19 claims
- 0786US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 0885US8867190B2Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereofKIM JONG HAN·Filed 2011·Granted Oct 21, 2014·5 cites·17 claims
- 0985US5280414AAu-Sn transient liquid bonding in high performance laminatesIBM·Filed 1990·Granted Jan 18, 1994·52 cites·6 claims
- 1083US10635421B2Electronic device, compiling method and computer-readable recording mediumSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 28, 2020·4 cites·9 claims
- 1182US12176584B2Gas diffusion layer for fuel cell, method of manufacturing the same, and unit cell for fuel cell including the sameHYUNDAI MOTOR CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·8 claims
- 1281US11117201B2Single-sided high feed cutting insert and cutting tool equipped with sameKORLOY INC·Filed 2017·Granted Sep 14, 2021·2 cites·14 claims
- 1381US9245689B2Multilayer ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 26, 2016·3 cites·10 claims
- 1480US11117202B2High-feed cutting insert and cutting tool equipped with sameKORLOY INC·Filed 2018·Granted Sep 14, 2021·2 cites·13 claims
- 1579US11276863B2Gas diffusion layer for fuel cell and method for manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2020·Granted Mar 15, 2022·1 cites·16 claims
- 1679US9202629B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 1, 2015·3 cites·10 claims
- 1777US7107730B2PSSC complex girderPARK JAE-MAN·Filed 2002·Granted Sep 19, 2006·24 cites·1 claims
- 1877US4869930AMethod for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallizationIBM·Filed 1988·Granted Sep 26, 1989·36 cites·23 claims
- 1974US8964354B2Multi-layered ceramic electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 24, 2015·2 cites·22 claims
- 2071US6318038B1Apparatus for retensing pre-stress structureFiled 1998·Granted Nov 20, 2001·25 cites·8 claims
- 2171US5421507AAu-Sn transient liquid bonding in high performance laminatesIBM·Filed 1993·Granted Jun 6, 1995·27 cites·6 claims
- 2270US12388090B2Gas diffusion layer unit for fuel cell and unit cell for fuel cell including sameHYUNDAI MOTOR CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 2370US10392499B2Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the compositionLG INNOTEK CO LTD·Filed 2015·Granted Aug 27, 2019·1 cites·5 claims
- 2470US9468096B2Epoxy resin composition, and printed circuit board using sameLG INNOTEK CO LTD·Filed 2013·Granted Oct 11, 2016·2 cites·9 claims
- 2569US9844142B2Radiant heat circuit board and method for manufacturing the sameCHO IN HEE·Filed 2011·Granted Dec 12, 2017·4 cites·10 claims
- 2669US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
- 2769US2025370913A1Apparatus and method for providing service for testing application, service providing system including same, and non-volatile recording medium having computer program recorded thereinSK PLANET CO LTD·Filed 2025·Application pending·0 cites
- 2868US2022200017A1Gas Diffusion Layer for Fuel Cell, Method of Manufacturing the Same, and Unit Cell for Fuel Cell Including the SameHYUNDAI MOTOR CO LTD·Filed 2021·Application pending·0 cites
- 2966US2024170699A1Antioxidant Liquid for Fuel Cell and Method of Charging SameHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 3065US9307675B2Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlightPARK HYUN GYU·Filed 2011·Granted Apr 5, 2016·2 cites·17 claims
- 3165US5122439AForming a pattern on a substrateIBM·Filed 1989·Granted Jun 16, 1992·30 cites·24 claims
- 3265US2024105963A1Method for manufacturing gas diffusion layer for fuel cell and gas diffusion layer manufactured therebyHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 3363US9657961B2Interior lamp for vehicle having air ventHYUNDAI MOTOR CO LTD·Filed 2014·Granted May 23, 2017·1 cites·8 claims
- 3463US9505914B2Inorganic filler, resin composition comprising the same and heat radiation substrate using the sameLG INNOTEK CO LTD·Filed 2015·Granted Nov 29, 2016·0 cites·17 claims
- 3563US4781970AStrengthening a ceramic by post sinter coating with a compressive surface layerIBM·Filed 1987·Granted Nov 1, 1988·28 cites·47 claims
- 3662US11611085B2Multiple perforation plate for separator of fuel cellHYUNDAI MOTOR CO LTD·Filed 2020·Granted Mar 21, 2023·0 cites·20 claims
- 3761US5340451AProcess for producing a metal organic polymer combinationIBM·Filed 1993·Granted Aug 23, 1994·22 cites·35 claims
- 3860US2023065789A1Gas diffusion layer for fuel cell including carboxymethyl cellulose and mehtod for producing the sameHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 3958US5173392AForming a pattern on a substrateIBM·Filed 1992·Granted Dec 22, 1992·27 cites·5 claims
- 4058US2025329622A1Circuit board and semiconductor package comprising sameLG INNOTEK CO LTD·Filed 2023·Application pending·0 cites
- 4157US9902841B2Inorganic filler, resin composition comprising the same and heat radiation substrate using the sameLG INNOTEK CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·13 claims
- 4257US2025226305A1Circuit board and semiconductor package comprising sameLG INNOTEK CO LTD·Filed 2023·Application pending·0 cites
- 4356US9670340B2Inorganic filler, resin composition comprising the same and heat radiation substrate using the sameLG INNOTEK CO LTD·Filed 2016·Granted Jun 6, 2017·0 cites·20 claims
- 4456US2025220810A1Circuit boardLG INNOTEK CO LTD·Filed 2023·Application pending·0 cites
- 4555US12395719B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 19, 2025·0 cites·18 claims
- 4654US12386194B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 12, 2025·0 cites·12 claims
- 4753US11570345B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 31, 2023·0 cites·25 claims
- 4853US10593957B2Gas diffusion layer for fuel cells and method of manufacturing the sameHYUNDAI MOTOR CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·18 claims
- 4953US2023204897A1Lens moduleSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 5051US11235688B2Device for folding emergency exit seat for busHYUNDAI MOTOR CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·15 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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