Inventor · disambiguated record

Ron Iwata

Also filed as: IWATA RON

1 granted patent·31 citations·filing 2007–2007

44Inventor score

Technology areasH05K

Files withPOWERTECH TECHNOLOGY INC1

Top patents by PatentIndex Score

1 record

0190US7619305B2Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stackingPOWERTECH TECHNOLOGY INC·Filed 2007·Granted Nov 17, 2009·31 cites·24 claims

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