Inventor · disambiguated record
Keung Chau
Also filed as: CHAU KEUNG
4 granted patents·10 citations·filing 2004–2011
68Inventor score
Top patents by PatentIndex Score
4 records- 0166US8633089B2Die bonding method utilizing rotary wafer tableNG MAN CHUNG·Filed 2011·Granted Jan 21, 2014·3 cites·12 claims
- 0263US7975982B2Electromagnetic valveDEFOND COMPONENTS LTD·Filed 2008·Granted Jul 12, 2011·4 cites·8 claims
- 0349US8397785B2Transfer apparatus for multiple adhesivesCHAU KEUNG·Filed 2009·Granted Mar 19, 2013·1 cites·9 claims
- 0439US7345254B2Die sorting apparatus and methodASM ASSEMBLY AUTOMATION LTD·Filed 2004·Granted Mar 18, 2008·2 cites·19 claims
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