Inventor · disambiguated record
Hiroshi Orikabe
Also filed as: ORIKABE HIROSHI
7 granted patents·4 pending applications·99 citations·filing 1998–2012
85Inventor score
Top patents by PatentIndex Score
11 records- 0177US6232426B1Epoxy resin compositionAJINOMOTO KK·Filed 1999·Granted May 15, 2001·30 cites·20 claims
- 0273US6380343B1Curable resin composition for overcoat of flexible circuitAJINOMOTO KK·Filed 2000·Granted Apr 30, 2002·9 cites·12 claims
- 0365US7282257B2Resin composition and adhesive film for multi-layered printing wiring boardAJINOMOTO KK·Filed 2004·Granted Oct 16, 2007·4 cites·16 claims
- 0463US6818702B1Thermosetting resin composition and flexible circuit overcoating material comprising the sameAJINOMOTO KK·Filed 2000·Granted Nov 16, 2004·11 cites·12 claims
- 0563US6335417B1Modified polyimide resin and thermosetting resin composition containing the sameAJINOMOTO KK·Filed 1999·Granted Jan 1, 2002·29 cites·14 claims
- 0654US6162889ACurable resin composition for overcoat of flexible circuitAJINOMOTO KK·Filed 1998·Granted Dec 19, 2000·15 cites·12 claims
- 0748US2006073315A1Metallized polyamideimide film for substrate and production method thereofAJINOMOTO KK·Filed 2005·Application pending·0 cites
- 0843US2007088134A1Thermosetting resin composition containing modified polyimide resinAJINOMOTO KK·Filed 2005·Application pending·0 cites
- 0942US2006073314A1Metallized polyimide film for substrate and production method thereofAJINOMOTO KK·Filed 2005·Application pending·0 cites
- 1035US2012175159A1Resin composition for use in release filmSAKAUCHI HIROYUKI·Filed 2012·Application pending·0 cites
- 1128US6433123B2Curable resin composition for overcoat of flexible circuitAJINOMOTO KK·Filed 1999·Granted Aug 13, 2002·1 cites·19 claims
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