Inventor · disambiguated record
Chung-Ping Eng
Also filed as: ENG CHUNG-PING
5 granted patents·3 pending applications·67 citations·filing 2000–2007
81Inventor score
Top patents by PatentIndex Score
8 records- 0179US7372158B2HDP-based ILD capping layerIBM·Filed 2006·Granted May 13, 2008·8 cites·15 claims
- 0275US7138717B2HDP-based ILD capping layerIBM·Filed 2004·Granted Nov 21, 2006·19 cites·10 claims
- 0374US6387790B1Conversion of amorphous layer produced during IMP Ti depositionIBM·Filed 2000·Granted May 14, 2002·19 cites·19 claims
- 0470US7008803B2Method of reworking structures incorporating low-k dielectric materialsIBM·Filed 2002·Granted Mar 7, 2006·14 cites·8 claims
- 0556US6436823B1Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formedIBM·Filed 2000·Granted Aug 20, 2002·7 cites·17 claims
- 0643US2009094567A1Immunity to charging damage in silicon-on-insulator devicesENG CHUNG-PING·Filed 2007·Application pending·0 cites
- 0743US2005285106A1Method of reworking structures incorporating low-k dielectric materialsIBM·Filed 2005·Application pending·0 cites
- 0843US2007271540A1Structure and method for reducing susceptibility to charging damage in soi designsIBM·Filed 2006·Application pending·0 cites
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