Inventor · disambiguated record
Katsuya Kosaki
Also filed as: KOSAKI KATSUYA
22 granted patents·3 pending applications·821 citations·filing 1991–2004
97Inventor score
Files withMITSUBISHI ELECTRIC CORP25
Top patents by PatentIndex Score
25 records- 0197US5441629AApparatus and method of electroplatingMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 15, 1995·117 cites·16 claims
- 0294US6391770B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 21, 2002·88 cites·9 claims
- 0394US5853559AApparatus for electroplating a semiconductor substrateMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Dec 29, 1998·101 cites·8 claims
- 0492US5998238AMethod of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 7, 1999·90 cites·31 claims
- 0585US5272111AMethod for manufacturing semiconductor device contactMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 21, 1993·82 cites·16 claims
- 0681US6603190B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 5, 2003·22 cites·5 claims
- 0778US5872396ASemiconductor device with plated heat sinkMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Feb 16, 1999·38 cites·3 claims
- 0876US6033540APlating apparatus for plating a waferMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 7, 2000·38 cites·6 claims
- 0974US6210554B1Method of plating semiconductor wafer and plated semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 3, 2001·34 cites·7 claims
- 1072US6268619B1Semiconductor device with high aspect ratio via hole including solder repelling coatingMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jul 31, 2001·36 cites·5 claims
- 1166US5800667AApparatus for adhering wafer to supporting substrateMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 1, 1998·36 cites·7 claims
- 1265US5338967ASemiconductor device structure with plated heat sink and supporting substrateMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Aug 16, 1994·29 cites·10 claims
- 1364US6245596B1Method of producing semiconductor device with heat dissipation metal layer and metal projectionsMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 12, 2001·26 cites·9 claims
- 1460US6500325B2Method of plating semiconductor wafer and plated semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Dec 31, 2002·5 cites·3 claims
- 1550US5770468AProcess for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphereMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jun 23, 1998·15 cites·11 claims
- 1650US5483092ASemiconductor device having a via-hole with a void area for reduced crackingMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jan 9, 1996·17 cites·4 claims
- 1749US5200641ASemiconductor device structure including bending-resistant radiating layerMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Apr 6, 1993·18 cites·17 claims
- 1848US6849865B1Chemical processorMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Feb 1, 2005·3 cites·3 claims
- 1948US6008537ASemiconductor device with heat dissipation metal layer and metal projectionsMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Dec 28, 1999·12 cites·4 claims
- 2046US6992016B2Chemical processing method, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Jan 31, 2006·2 cites·8 claims
- 2140US6335265B1Method for manufacturing semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 1, 2002·7 cites·5 claims
- 2238US2004060824A1Chemical treatment, plating, and residue elimination methodMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 2336US2002139663A1Chemical treatment systemMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 2435US2002139684A1Plating system, plating method, method of manufacturing semiconductor device using the same, and method of manufacturing printed board using the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 2534US5786634ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jul 28, 1998·5 cites·6 claims
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