Inventor · disambiguated record
Deepak Mahulikar
Also filed as: MAHULIKAR DEEPAK
82 granted patents·9 pending applications·4,393 citations·filing 1984–2018
99Inventor score
Files withOLIN CORP55FUJIFILM PLANAR SOLUTIONS LLC11PLANAR SOLUTIONS LLC6ARCH SPEC CHEM INC5MOHSENI SAEED H4
Top patents by PatentIndex Score
91 records- 0198US5608267AMolded plastic semiconductor package including heat spreaderOLIN CORP·Filed 1994·Granted Mar 4, 1997·339 cites·20 claims
- 0298US5399187ALead-free bullettOLIN CORP·Filed 1993·Granted Mar 21, 1995·212 cites·8 claims
- 0397US6083840ASlurry compositions and method for the chemical-mechanical polishing of copper and copper alloysARCH SPEC CHEM INC·Filed 1998·Granted Jul 4, 2000·299 cites·28 claims
- 0495US6468913B1Ready-to-use stable chemical-mechanical polishing slurriesARCH SPEC CHEM INC·Filed 2000·Granted Oct 22, 2002·63 cites·37 claims
- 0595US5578869AComponents for housing an integrated circuit deviceOLIN CORP·Filed 1994·Granted Nov 26, 1996·278 cites·34 claims
- 0695US4888449ASemiconductor packageOLIN CORP·Filed 1988·Granted Dec 19, 1989·152 cites·47 claims
- 0794US5814759ALead-free shotOLIN CORP·Filed 1997·Granted Sep 29, 1998·72 cites·7 claims
- 0893US6447563B1Chemical mechanical polishing slurry system having an activator solutionARCH SPEC CHEM INC·Filed 1999·Granted Sep 10, 2002·127 cites·39 claims
- 0993US4897508AMetal electronic packageOLIN CORP·Filed 1988·Granted Jan 30, 1990·121 cites·36 claims
- 1093US4882212AElectronic packaging of components incorporating a ceramic-glass-metal compositeOLIN CORP·Filed 1986·Granted Nov 21, 1989·114 cites·29 claims
- 1192US5629835AMetal ball grid array package with improved thermal conductivityOLIN CORP·Filed 1994·Granted May 13, 1997·138 cites·13 claims
- 1292US5367196AMolded plastic semiconductor package including an aluminum alloy heat spreaderOLIN CORP·Filed 1992·Granted Nov 22, 1994·131 cites·29 claims
- 1392US4939316AAluminum alloy semiconductor packagesOLIN CORP·Filed 1988·Granted Jul 3, 1990·98 cites·42 claims
- 1489US5559306AElectronic package with improved electrical performanceOLIN CORP·Filed 1995·Granted Sep 24, 1996·110 cites·8 claims
- 1588US5122858ALead frame having polymer coated surface portionsOLIN CORP·Filed 1990·Granted Jun 16, 1992·113 cites·34 claims
- 1687US8303806B2Fluid processingMOHSENI SAEED H·Filed 2010·Granted Nov 6, 2012·10 cites·20 claims
- 1786US6262477B1Ball grid array electronic packageADVANCED INTERCONNECT TECH LTD·Filed 1993·Granted Jul 17, 2001·88 cites·28 claims
- 1886US5098864AProcess for manufacturing a metal pin grid array packageOLIN CORP·Filed 1991·Granted Mar 24, 1992·88 cites·23 claims
- 1985US9735031B2Polishing compositions and methods for polishing cobalt filmsFUJIFILM PLANAR SOLUTIONS LLC·Filed 2015·Granted Aug 15, 2017·4 cites·17 claims
- 2085US5477008APolymer plug for electronic packagesOLIN CORP·Filed 1993·Granted Dec 19, 1995·95 cites·10 claims
- 2185US5343073ALead frames having a chromium and zinc alloy coatingOLIN CORP·Filed 1993·Granted Aug 30, 1994·68 cites·14 claims
- 2285US4872047ASemiconductor die attach systemOLIN CORP·Filed 1986·Granted Oct 3, 1989·72 cites·21 claims
- 2384US5399805AMetal electronic package with reduced seal widthOLIN CORP·Filed 1993·Granted Mar 21, 1995·66 cites·19 claims
- 2484US5020439AProjectile having improved baseplugOLIN CORP·Filed 1989·Granted Jun 4, 1991·36 cites·20 claims
- 2584US5015803AThermal performance package for integrated circuit chipOLIN CORP·Filed 1989·Granted May 14, 1991·55 cites·19 claims
- 2684US4821151AHermetically sealed packageOLIN CORP·Filed 1985·Granted Apr 11, 1989·71 cites·39 claims
- 2783US4961106AMetal packages having improved thermal dissipationOLIN CORP·Filed 1987·Granted Oct 2, 1990·59 cites·40 claims
- 2882US8211193B2Ultrapure colloidal silica for use in chemical mechanical polishing applicationsMAHULIKAR DEEPAK·Filed 2006·Granted Jul 3, 2012·10 cites·16 claims
- 2982US5688606AAnodized aluminum substrate having increased breakdown voltageOLIN CORP·Filed 1996·Granted Nov 18, 1997·64 cites·7 claims
- 3082US5449951ALead frames with improved adhesion to a polymerOLIN CORP·Filed 1994·Granted Sep 12, 1995·56 cites·8 claims
- 3182US5315155AElectronic package with stress relief channelOLIN CORP·Filed 1992·Granted May 24, 1994·74 cites·12 claims
- 3282US5043534AMetal electronic package having improved resistance to electromagnetic interferenceOLIN CORP·Filed 1990·Granted Aug 27, 1991·76 cites·38 claims
- 3381US11925912B2Fluid processing systems including a plurality of material tanks, at least one mixing tank, at least one holding tank, and recirculation loopsFUJIFILM ELECTRONIC MAT USA INC·Filed 2018·Granted Mar 12, 2024·2 cites·16 claims
- 3481US9735030B2Polishing compositions and methods for polishing cobalt filmsFUJIFILM PLANAR SOLUTIONS LLC·Filed 2014·Granted Aug 15, 2017·4 cites·14 claims
- 3580US5506446AElectronic package having improved wire bonding capabilityOLIN CORP·Filed 1995·Granted Apr 9, 1996·67 cites·34 claims
- 3680US5066368AProcess for producing black integrally colored anodized aluminum componentsOLIN CORP·Filed 1990·Granted Nov 19, 1991·60 cites·18 claims
- 3780US4799973AProcess for treating copper-nickel alloys for use in brazed assemblies and productOLIN CORP·Filed 1984·Granted Jan 24, 1989·30 cites·23 claims
- 3878US6749488B2Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafersPLANAR SOLUTIONS LLC·Filed 2002·Granted Jun 15, 2004·24 cites·2 claims
- 3977US6158351AFerromagnetic bulletOLIN CORP·Filed 1996·Granted Dec 12, 2000·42 cites·6 claims
- 4077US5103292AMetal pin grid array packageOLIN CORP·Filed 1989·Granted Apr 7, 1992·46 cites·22 claims
- 4177US5024883AElectronic packaging of components incorporating a ceramic-glass-metal compositeOLIN CORP·Filed 1989·Granted Jun 18, 1991·47 cites·22 claims
- 4276US5504372AAdhesively sealed metal electronic package incorporating a multi-chip moduleOLIN CORP·Filed 1994·Granted Apr 2, 1996·44 cites·10 claims
- 4375US5324888AMetal electronic package with reduced seal widthOLIN CORP·Filed 1992·Granted Jun 28, 1994·45 cites·34 claims
- 4474US5013871AKit for the assembly of a metal electronic packageOLIN CORP·Filed 1990·Granted May 7, 1991·50 cites·15 claims
- 4573US10159949B2Advanced fluid processing methods and systemsFUJIFILM PLANAR SOLUTIONS LLC·Filed 2017·Granted Dec 25, 2018·1 cites·40 claims
- 4672US8961815B2Composition for advanced node front-and back-end of line chemical mechanical polishingHU BIN·Filed 2010·Granted Feb 24, 2015·3 cites·8 claims
- 4772US5534356AAnodized aluminum substrate having increased breakdown voltageOLIN CORP·Filed 1995·Granted Jul 9, 1996·38 cites·5 claims
- 4872US4704626AGraded sealing systems for semiconductor packageOLIN CORP·Filed 1985·Granted Nov 3, 1987·40 cites·13 claims
- 4969US8779011B2Ultrapure colloidal silica for use in chemical mechanical polishing applicationsMAHULIKAR DEEPAK·Filed 2012·Granted Jul 15, 2014·2 cites·7 claims
- 5069US5939214AThermal performance package for integrated circuit chipADVANCED TECHNOLOGY INTERCONNE·Filed 1992·Granted Aug 17, 1999·34 cites·10 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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