Inventor · disambiguated record
Mary Annie Cheong
Also filed as: CHEONG MARY ANNIE
4 granted patents·7 citations·filing 2007–2016
64Inventor score
Technology areasH10W
Files withRETUTA DANNY1UNITED TEST & ASSEMBLY CT LT1UNITED TEST & ASSEMBLY CT LTD1UNITED TEST AND ASSEMBLY CENTER LTD1
Top patents by PatentIndex Score
4 records- 0169US7723833B2Stacked die packagesUNITED TEST & ASSEMBLY CT LTD·Filed 2007·Granted May 25, 2010·5 cites·18 claims
- 0259US8030768B2Semiconductor package with under bump metallization aligned with open viasUNITED TEST & ASSEMBLY CT LT·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 0345US9842792B2Method of producing a semiconductor packageUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2016·Granted Dec 12, 2017·0 cites·17 claims
- 0440US9281218B2Method of producing a semiconductor packageRETUTA DANNY·Filed 2007·Granted Mar 8, 2016·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →