Inventor · disambiguated record
Joachim Heinz Schober
Also filed as: SCHOBER JOACHIM · SCHOBER JOACHIM H · SCHOBER JOACHIM HEINZ
14 granted patents·2 pending applications·67 citations·filing 1999–2009
90Inventor score
Files withKONINKL PHILIPS ELECTRONICS NV8NXP BV2SCHOBER JOACHIM HEINZ2PHILIPS CORP1SCHERABON CHRISTIAN1
Top patents by PatentIndex Score
16 records- 0170US6712279B2Data carrier comprising an array of contactsKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Mar 30, 2004·18 cites·5 claims
- 0261US6552422B1Data carrier with an integrated electronic component and with a transmission coil which comprises turn portions arranged directly against said componentKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Apr 22, 2003·8 cites·10 claims
- 0359US7245005B2Lead-frame configuration for chipsNXP BV·Filed 2002·Granted Jul 17, 2007·8 cites·20 claims
- 0454US6593664B2Chip module with bond-wire connections with small loop heightKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Jul 15, 2003·7 cites·7 claims
- 0552US6680523B2Semiconductor wafer with process control modulesFiled 2002·Granted Jan 20, 2004·4 cites·4 claims
- 0652US6567169B1Method of and device for determining the warpage of a waferKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted May 20, 2003·6 cites·5 claims
- 0749US7124956B2Product comprising product sub-parts connected to each other by a crimp connectionKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Oct 24, 2006·3 cites·7 claims
- 0844US6643142B2Module having a lead frame equipped with components on both sidesKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Nov 4, 2003·3 cites·9 claims
- 0943US8659132B2Microelectronic package assembly, method for disconnecting a microelectronic packageSCHOBER JOACHIM HEINZ·Filed 2009·Granted Feb 25, 2014·0 cites·6 claims
- 1043US6657294B2Data carrier having an IC module with a protection mechanism for protecting the parts of the IC module from mechanical stressKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Dec 2, 2003·3 cites·6 claims
- 1141US7733657B2Module base unit with strain relief meansNXP BV·Filed 2005·Granted Jun 8, 2010·0 cites·15 claims
- 1240US2008149730A1Module With At Least Two Pairs of Module Connecting PlatesKONINKL PHILIPS ELECTRONICS NV·Filed 2004·Application pending·0 cites
- 1335US2004140122A1Product comprising a substrate and a chip attached to the substrateFiled 2002·Application pending·0 cites
- 1434US8695881B2Chip card for insertion into a holderSCHOBER JOACHIM HEINZ·Filed 2005·Granted Apr 15, 2014·0 cites·13 claims
- 1532US9047548B2Semiconductor chip, transponder and method of manufacturing a transponderSCHERABON CHRISTIAN·Filed 2007·Granted Jun 2, 2015·0 cites·14 claims
- 1631US6285561B1Data carrier module device having integrated circuit and transmission coil connection contacts covered by a common protective capPHILIPS CORP·Filed 1999·Granted Sep 4, 2001·7 cites·8 claims
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