Inventor · disambiguated record
Ju-Hyun Lyu
Also filed as: LYU JU-HYUN
4 granted patents·2 pending applications·336 citations·filing 2000–2013
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0195US7015590B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 21, 2006·119 cites·18 claims
- 0295US6849949B1Thin stacked packageSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Feb 1, 2005·108 cites·26 claims
- 0393US6878570B2Thin stacked package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 12, 2005·83 cites·12 claims
- 0492US7271084B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 18, 2007·26 cites·42 claims
- 0539US2014015148A1Semiconductor package and method of manufacturing the sameLYU JU-HYUN·Filed 2013·Application pending·0 cites
- 0639US2013295721A1Apparatus to fabricate flip-chip packages and method of fabricating flip-chip packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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