Inventor · disambiguated record

Oh-Se Yong

Also filed as: YONG OH-SE

2 granted patents·145 citations·filing 2004–2006

70Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD2

Top patents by PatentIndex Score

2 records

0195US7015590B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 21, 2006·119 cites·18 claims
0292US7271084B2Reinforced solder bump structure and method for forming a reinforced solder bumpSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 18, 2007·26 cites·42 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →