Inventor · disambiguated record
William E. Sablinski
Also filed as: SABLINSKI WILLIAM · SABLINSKI WILLIAM E · SABLINSKI WILLIAM EDWARD
24 granted patents·1 pending application·694 citations·filing 1990–2009
97Inventor score
Top patents by PatentIndex Score
25 records- 0193US6283359B1Method for enhancing fatigue life of ball grid arraysIBM·Filed 2000·Granted Sep 4, 2001·53 cites·5 claims
- 0292US6740959B2EMI shielding for semiconductor chip carriersIBM·Filed 2001·Granted May 25, 2004·97 cites·28 claims
- 0388US6429388B1High density column grid array connections and method thereofIBM·Filed 2000·Granted Aug 6, 2002·53 cites·14 claims
- 0484US6235996B1Interconnection structure and process module assembly and reworkIBM·Filed 1998·Granted May 22, 2001·65 cites·35 claims
- 0582US6518674B2Temporary attach article and method for temporary attach of devices to a substrateIBM·Filed 2001·Granted Feb 11, 2003·23 cites·7 claims
- 0682US6158644AMethod for enhancing fatigue life of ball grid arraysIBM·Filed 1998·Granted Dec 12, 2000·43 cites·9 claims
- 0781US6892925B2Solder hierarchy for lead free solder jointIBM·Filed 2002·Granted May 17, 2005·28 cites·16 claims
- 0881US6854636B2Structure and method for lead free solder electronic package interconnectionsIBM·Filed 2002·Granted Feb 15, 2005·20 cites·14 claims
- 0979US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 1078US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 1174US6574859B2Interconnection process for module assembly and reworkIBM·Filed 2001·Granted Jun 10, 2003·18 cites·25 claims
- 1274US6278184B1Solder disc connectionIBM·Filed 1999·Granted Aug 21, 2001·35 cites·14 claims
- 1372US7473997B2Method for forming robust solder interconnect structures by reducing effects of seed layer underetchingIBM·Filed 2005·Granted Jan 6, 2009·4 cites·10 claims
- 1468US5153408AMethod and structure for repairing electrical linesIBM·Filed 1990·Granted Oct 6, 1992·33 cites·44 claims
- 1567US6253986B1Solder disc connectionIBM·Filed 1999·Granted Jul 3, 2001·25 cites·5 claims
- 1660US7932342B2Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend systemIBM·Filed 2008·Granted Apr 26, 2011·0 cites·1 claims
- 1760US6070321ASolder disc connectionIBM·Filed 1997·Granted Jun 6, 2000·20 cites·12 claims
- 1860US5605277AHot vacuum device removal process and apparatusIBM·Filed 1994·Granted Feb 25, 1997·18 cites·12 claims
- 1956US5543584AStructure for repairing electrical linesIBM·Filed 1992·Granted Aug 6, 1996·21 cites·24 claims
- 2052US5868304ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1996·Granted Feb 9, 1999·19 cites·9 claims
- 2150US6827505B2Optoelectronic package structure and process for planar passive optical and optoelectronic devicesIBM·Filed 2002·Granted Dec 7, 2004·4 cites·20 claims
- 2245US7767575B2Forming robust solder interconnect structures by reducing effects of seed layer underetchingTESSERA INTELLECTUAL PROPERTIE·Filed 2009·Granted Aug 3, 2010·0 cites·5 claims
- 2343US2005106059A1Structure and method for lead free solder electronic package interconnectionsFiled 2004·Application pending·0 cites
- 2432US6303400B1Temporary attach article and method for temporary attach of devices to a substrateIBM·Filed 1999·Granted Oct 16, 2001·2 cites·18 claims
- 2532US6070782ASocketable bump grid array shaped-solder on copper spheresIBM·Filed 1998·Granted Jun 6, 2000·3 cites·5 claims
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