Inventor · disambiguated record
Takao Inaba
Also filed as: INABA TAKAO
24 granted patents·614 citations·filing 1983–2007
97Inventor score
Top patents by PatentIndex Score
24 records- 0192USD286547SPenPILOT INK CO LTD·Filed 1984·Granted Nov 4, 1986·54 cites·1 claims
- 0290US6196905B1Wafer polishing apparatus with retainer ringTOKYO SEIMITSU CO LTD·Filed 2000·Granted Mar 6, 2001·34 cites·2 claims
- 0388US7578631B2Direct-fluid-supply writing implementPILOT INK CO LTD·Filed 2005·Granted Aug 25, 2009·14 cites·43 claims
- 0488US4671692AWriting pen holder with three wicksPILOT INK CO LTD·Filed 1985·Granted Jun 9, 1987·54 cites·5 claims
- 0587US6059636AWafer polishing apparatusTOKYO SEIMITSU CO LTD·Filed 1998·Granted May 9, 2000·73 cites·3 claims
- 0687US5931725AWafer polishing machineTOKYO SEIMITSU CO LTD·Filed 1997·Granted Aug 3, 1999·100 cites·5 claims
- 0786US4496258AWriting pen with space behind nibPILOT INK CO LTD·Filed 1983·Granted Jan 29, 1985·42 cites·1 claims
- 0882US6033292AWafer polishing apparatus with retainer ringTOKYO SEIMITSU CO LTD·Filed 1998·Granted Mar 7, 2000·46 cites·5 claims
- 0976US8128304B2Direct-fluid-supply writing implementKURITA TETSUHIRO·Filed 2007·Granted Mar 6, 2012·8 cites·26 claims
- 1071US6203414B1Polishing apparatusTOKYO SEIMITSU CO LTD·Filed 1998·Granted Mar 20, 2001·34 cites·25 claims
- 1170US4844642ACap for writing equipmentPILOT INK CO LTD·Filed 1988·Granted Jul 4, 1989·30 cites·11 claims
- 1267US6402589B1Wafer grinder and method of detecting grinding amountTOKYO SEIMITSU CO LTD·Filed 1999·Granted Jun 11, 2002·28 cites·19 claims
- 1365US6623344B2Wafer polishing apparatusTOKYO SEIMITSU CO LTD·Filed 2001·Granted Sep 23, 2003·9 cites·12 claims
- 1458US5961378APolishing apparatusTOKYO SEIMITSU CO LTD·Filed 1998·Granted Oct 5, 1999·19 cites·4 claims
- 1554US6494768B2Wafer polishing apparatusTOKYO SEIMITSU CO LTD·Filed 2001·Granted Dec 17, 2002·4 cites·1 claims
- 1652US6296555B1Wafer machining apparatusTOKYO SEIMITSU CO LTD·Filed 1999·Granted Oct 2, 2001·15 cites·4 claims
- 1744US6302762B1Wafer polishing apparatusTOKYO SEIMITSU CO LTD·Filed 1999·Granted Oct 16, 2001·8 cites·1 claims
- 1843US6010269AWriting implementPILOT INK CO LTD·Filed 1998·Granted Jan 4, 2000·7 cites·11 claims
- 1943US5948206AApparatus for determining removed amount of waferTOKYO SEIMITSU CO LTD·Filed 1997·Granted Sep 7, 1999·10 cites·1 claims
- 2042US5876272ASemiconductor wafer polishing machineTOKYO SEIMITSU CO LTD·Filed 1997·Granted Mar 2, 1999·11 cites·4 claims
- 2138US6080049AWafer polishing apparatusTOKYO SEIMITSU CO LTD·Filed 1998·Granted Jun 27, 2000·7 cites·14 claims
- 2237US6547650B2Polishing apparatusTOKYO SEIMITSU CO LTD·Filed 2001·Granted Apr 15, 2003·0 cites·13 claims
- 2334US6354914B1Wafer polishing apparatusTOKYO SEIMITSU CO LTD·Filed 1999·Granted Mar 12, 2002·3 cites·8 claims
- 2434US6346037B1Wafer polishing machineTOKYO SEIMITSU CO LTD·Filed 1999·Granted Feb 12, 2002·4 cites·2 claims
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