Inventor · disambiguated record
Michael P. Laughner
Also filed as: LAUGHNER MICHAEL · LAUGHNER MICHAEL P · LAUGHNER MICHAEL PAUL
27 granted patents·1 pending application·584 citations·filing 1991–2020
97Inventor score
Top patents by PatentIndex Score
28 records- 0197US7943952B2Method of uniform phosphor chip coating and LED package fabricated using methodCREE INC·Filed 2007·Granted May 17, 2011·64 cites·28 claims
- 0297US7528040B2Methods of fabricating silicon carbide devices having smooth channelsCREE INC·Filed 2005·Granted May 5, 2009·51 cites·30 claims
- 0395US7422634B2Three inch silicon carbide wafer with low warp, bow, and TTVCREE INC·Filed 2005·Granted Sep 9, 2008·59 cites·17 claims
- 0494US8696159B2Multi-chip LED devicesANDREWS PETER SCOTT·Filed 2011·Granted Apr 15, 2014·16 cites·29 claims
- 0594US5258455APolyphenylene ether-olefin polymer compositions with improved propertiesGEN ELECTRIC·Filed 1992·Granted Nov 2, 1993·79 cites·10 claims
- 0693US7393790B2Method of manufacturing carrier wafer and resulting carrier wafer structuresCREE INC·Filed 2005·Granted Jul 1, 2008·28 cites·27 claims
- 0792USD650343SMultiple configuration light emitting device packageANDREWS PETER S·Filed 2011·Granted Dec 13, 2011·55 cites·1 claims
- 0889US10600937B1Precise bondline control between LED componentsLUMILEDS HOLDING BV·Filed 2018·Granted Mar 24, 2020·2 cites·15 claims
- 0987US9515055B2Light emitting devices including multiple anodes and cathodesBRITT JEFFREY CARL·Filed 2012·Granted Dec 6, 2016·11 cites·34 claims
- 1085USD660257SEmitter packageANDREWS PETER SCOTT·Filed 2011·Granted May 22, 2012·33 cites·1 claims
- 1185USD658139SHigh-density emitter packageANDREWS PETER SCOTT·Filed 2011·Granted Apr 24, 2012·34 cites·1 claims
- 1281US9041042B2High density multi-chip LED devicesANDREWS PETER SCOTT·Filed 2011·Granted May 26, 2015·4 cites·21 claims
- 1379US9627361B2Multiple configuration light emitting devices and methodsANDREWS PETER S·Filed 2011·Granted Apr 18, 2017·5 cites·28 claims
- 1475USD713804SLight emitting diode (LED) package with multiple anodes and cathodesBRITT JEFFREY CARL·Filed 2012·Granted Sep 23, 2014·22 cites·1 claims
- 1575US6054078AIntegrally bonded, multilayer foamed productNOMACO INC·Filed 1998·Granted Apr 25, 2000·30 cites·14 claims
- 1671USD711841SLight emitting diode (LED) packageBRITT JEFFREY CARL·Filed 2012·Granted Aug 26, 2014·17 cites·1 claims
- 1769US5904970AIntegrally bonded, multilayer foamed productNOMACO INC·Filed 1997·Granted May 18, 1999·23 cites·13 claims
- 1867US11233175B2Precise bondline control between LED componentsLUMILEDS LLC·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 1965US8859366B2Methods of fabricating silicon carbide devices having smooth channelsDAS MRINAL K·Filed 2012·Granted Oct 14, 2014·1 cites·15 claims
- 2061US8188483B2Silicon carbide devices having smooth channelsDAS MRINAL K·Filed 2009·Granted May 29, 2012·1 cites·32 claims
- 2159US5264487ACompositions derived from recycled polymersGEN ELECTRIC·Filed 1992·Granted Nov 23, 1993·15 cites·17 claims
- 2257US9142663B2Silicon carbide devices having smooth channelsCREE INC·Filed 2014·Granted Sep 22, 2015·0 cites·8 claims
- 2355US2015048393A1High density multi-chip led devicesCREE INC·Filed 2014·Application pending·0 cites
- 2453US11545597B2Fabrication for precise line-bond control and gas diffusion between LED componentsLUMILEDS LLC·Filed 2019·Granted Jan 3, 2023·0 cites·17 claims
- 2551USD712849SLight emitting diode (LED) package with multiple anodes and cathodesBRITT JEFFREY CARL·Filed 2012·Granted Sep 9, 2014·8 cites·1 claims
- 2651US5177146ACommingled household plastic scrap processing and modificationGEN ELECTRIC·Filed 1991·Granted Jan 5, 1993·10 cites·18 claims
- 2751US5171778AMelt blends of polyestersGEN ELECTRIC·Filed 1991·Granted Dec 15, 1992·13 cites·10 claims
- 2834US5306771AHigh rubber graft thermoplastic composition with improved mechanical properties prepared by melt blendingGEN ELECTRIC·Filed 1993·Granted Apr 26, 1994·3 cites·18 claims
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