Inventor · disambiguated record
Thomas Stoek
Also filed as: STOEK THOMAS
17 granted patents·2 pending applications·21 citations·filing 2017–2023
89Inventor score
Files withINFINEON TECHNOLOGIES AG19
Top patents by PatentIndex Score
19 records- 0189US9978672B1Transistor package with terminals coupled via chip carrierINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 22, 2018·9 cites·23 claims
- 0287US11621204B2Molded semiconductor module having a mold step for increasing creepage distanceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 4, 2023·3 cites·22 claims
- 0378US11101201B2Semiconductor package having leads with a negative standoffINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 24, 2021·2 cites·16 claims
- 0475US10147703B2Semiconductor package for multiphase circuitry deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 4, 2018·3 cites·23 claims
- 0573US11769748B2Semiconductor device having a metal clip with a solder volume balancing reservoirINFINEON TECHNOLOGIES AG·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 0671US10651109B2Selective plating of semiconductor package leadsINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 12, 2020·2 cites·24 claims
- 0768US10886199B1Molded semiconductor package with double-sided coolingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·20 claims
- 0868US2023282553A1Power electronic assembly and power module for embedding in a printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0967US11862541B2Molded semiconductor package having a negative standoffINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·0 cites·17 claims
- 1067US11699640B2Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of productionINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jul 11, 2023·0 cites·17 claims
- 1166US10319671B2Semiconductor package with leadframeINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 11, 2019·1 cites·20 claims
- 1264US11545459B2Metal clip with solder volume balancing reservoirINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 3, 2023·0 cites·16 claims
- 1356US10971436B2Multi-branch terminal for integrated circuit (IC) packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 1454US10354943B1Multi-branch terminal for integrated circuit (IC) packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 16, 2019·0 cites·20 claims
- 1552US11302613B2Double-sided cooled molded semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·0 cites·20 claims
- 1651US11901257B2Semiconductor package, metal sheet for use in a semiconductor package, and method for producing a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 13, 2024·0 cites·23 claims
- 1750US11183445B2Semiconductor arrangement, laminated semiconductor arrangement and method for fabricating a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 1845US12046540B2Leadframe package with adjustable clipINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
- 1941US2022115245A1Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →