Inventor · disambiguated record
Kin P. Cheung
Also filed as: CHEUNG KIN · CHEUNG KIN P · CHEUNG KIN PING
12 granted patents·2 pending applications·194 citations·filing 1990–2019
90Inventor score
Files withAGERE SYST GUARDIAN CORP2AGERE SYSTEMS INC1AT & T BELL LAB1CHEUNG KIN P1GLOBAL RESONANCE TECH LLC1
Top patents by PatentIndex Score
14 records- 0190US6936494B2Processes for hermetically packaging wafer level microscopic structuresUNIV RUTGERS·Filed 2003·Granted Aug 30, 2005·90 cites·19 claims
- 0282US11507135B2Molecular scrivener for reading or writing data to a macromoleculeGOVERNMENT OF THE US SECRETARY OF COMMERCE·Filed 2019·Granted Nov 22, 2022·6 cites·20 claims
- 0377US9507004B2Electron spin resonance spectrometer and method for using sameNAT INST OF STANDARDS & TECH·Filed 2014·Granted Nov 29, 2016·3 cites·20 claims
- 0471US5908312ASemiconductor device fabricationLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jun 1, 1999·39 cites·12 claims
- 0562US7548067B2Methods for measuring capacitanceSEMATECH INC·Filed 2006·Granted Jun 16, 2009·4 cites·8 claims
- 0652US5008217AProcess for fabricating integrated circuits having shallow junctionsAT & T BELL LAB·Filed 1990·Granted Apr 16, 1991·23 cites·6 claims
- 0750US6524872B1Using fast hot-carrier aging method for measuring plasma charging damageAGERE SYSTEMS INC·Filed 1999·Granted Feb 25, 2003·16 cites·39 claims
- 0846US10241149B2Massively parallel wafer-level reliability system and process for massively parallel wafer-level reliability testingUS COMMERCE·Filed 2016·Granted Mar 26, 2019·0 cites·20 claims
- 0945US6365426B1Method of determining the impact of plasma-charging damage on yield and reliability in submicron integrated circuitsAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 2, 2002·1 cites·15 claims
- 1044US6469390B2Device comprising thermally stable, low dielectric constant materialAGERE SYST GUARDIAN CORP·Filed 1999·Granted Oct 22, 2002·12 cites·19 claims
- 1141US10247814B2Phase shift detector process for making and use of sameNATIONAL INSTITUTE OF STANDARDS AND TECH·Filed 2016·Granted Apr 2, 2019·0 cites·16 claims
- 1239US2005189621A1Processes for hermetically packaging wafer level microscopic structuresFiled 2005·Application pending·0 cites
- 1339US2005250253A1Processes for hermetically packaging wafer level microscopic structuresCHEUNG KIN P·Filed 2005·Application pending·0 cites
- 1429US11294075B2Non-resonant electron spin resonant probe and associated hardwareGLOBAL RESONANCE TECH LLC·Filed 2018·Granted Apr 5, 2022·0 cites·8 claims
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