Inventor · disambiguated record
Boris Relja
Also filed as: RELJA BORIS
3 granted patents·259 citations·filing 2000–2002
79Inventor score
Technology areasH10P
Files withCVC PRODUCTS INC3
Top patents by PatentIndex Score
3 records- 0197US6365502B1Microelectronic interconnect material with adhesion promotion layer and fabrication methodCVC PRODUCTS INC·Filed 2000·Granted Apr 2, 2002·153 cites·17 claims
- 0291US6645847B2Microelectronic interconnect material with adhesion promotion layer and fabrication methodCVC PRODUCTS INC·Filed 2002·Granted Nov 11, 2003·47 cites·22 claims
- 0391US6627995B2Microelectronic interconnect material with adhesion promotion layer and fabrication methodCVC PRODUCTS INC·Filed 2002·Granted Sep 30, 2003·59 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →