Inventor · disambiguated record
James Fred Salzman
Also filed as: SALZMAN JAMES F · SALZMAN JAMES FRED
24 granted patents·4 pending applications·262 citations·filing 1985–2020
95Inventor score
Top patents by PatentIndex Score
28 records- 0195US7928538B2Package-level electromagnetic interference shieldingTEXAS INSTRUMENTS INC·Filed 2006·Granted Apr 19, 2011·45 cites·10 claims
- 0294US8004860B2Radiofrequency and electromagnetic interference shieldingTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 23, 2011·34 cites·23 claims
- 0394US7181192B2Handheld portable automatic emergency alert system and methodTEXAS INSTRUMENTS INC·Filed 2004·Granted Feb 20, 2007·104 cites·9 claims
- 0493US10428298B1Methanol slicing of wineSALZMAN JAMES FRED·Filed 2018·Granted Oct 1, 2019·12 cites·12 claims
- 0588US9281232B2Device having improved radiation hardness and high breakdown voltagesTEXAS INSTRUMENTS INC·Filed 2014·Granted Mar 8, 2016·6 cites·4 claims
- 0686US7453142B2System and method for implementing transformer on package substrateTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 18, 2008·16 cites·16 claims
- 0785US9281245B2Latchup reduction by grown orthogonal substratesTEXAS INSTRUMENTS INC·Filed 2013·Granted Mar 8, 2016·7 cites·20 claims
- 0880US11574887B2Flip chip backside mechanical die grounding techniquesTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 7, 2023·1 cites·15 claims
- 0979US11043467B2Flip chip backside die grounding techniquesTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 22, 2021·1 cites·10 claims
- 1078US10600753B2Flip chip backside mechanical die grounding techniquesTEXAS INSTRUMENTS INC·Filed 2016·Granted Mar 24, 2020·2 cites·20 claims
- 1177US9741791B2Latchup reduction by grown orthogonal substratesTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 22, 2017·2 cites·20 claims
- 1277US8558353B2Integrated circuit having an uppermost layer comprising landing pads that are distributed thoughout one side of the integrated circuitSALZMAN JAMES F·Filed 2006·Granted Oct 15, 2013·10 cites·25 claims
- 1377US8530298B2Radiation hardened integrated circuitROYBAL RICHARD G·Filed 2011·Granted Sep 10, 2013·8 cites·15 claims
- 1474US9079002B1Ceramic nanochannel drug delivery device and method of formationTEXAS INSTRUMENTS INC·Filed 2014·Granted Jul 14, 2015·2 cites·13 claims
- 1571US10002870B2Process enhancement using double sided epitaxial on substrateTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 19, 2018·1 cites·20 claims
- 1669US10607958B2Flip chip backside die grounding techniquesTEXAS INSTRUMENTS INC·Filed 2016·Granted Mar 31, 2020·1 cites·10 claims
- 1763US11056490B2Process enhancement using double sided epitaxial on substrateTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 6, 2021·0 cites·20 claims
- 1859US10304827B2Process enhancement using double sided epitaxial on substrateTEXAS INSTRUMENTS INC·Filed 2018·Granted May 28, 2019·0 cites·20 claims
- 1956US9620586B2Device having improved radiation hardness and high breakdown voltagesTEXAS INSTRUMENTS INC·Filed 2016·Granted Apr 11, 2017·0 cites·20 claims
- 2055US10043867B2Latchup reduction by grown orthogonal substratesTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 7, 2018·0 cites·20 claims
- 2155US9653544B2Methods for fabricating radiation hardened MOS devicesTEXAS INSTRUMENTS INC·Filed 2016·Granted May 16, 2017·0 cites·18 claims
- 2254US4704548AHigh to low transition speed up circuit for TTL-type gatesTEXAS INSTRUMENTS INC·Filed 1985·Granted Nov 3, 1987·10 cites·13 claims
- 2343US2008084311A1Inductance enhancement by magnetic material introductionTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2442US2008023824A1Double-sided dieTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2541US9006864B2Radiation induced diode structureTEXAS INSTRUMENTS INC·Filed 2013·Granted Apr 14, 2015·0 cites·20 claims
- 2638US2005206015A1System and method for attenuating electromagnetic interferenceTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 2734US12426286B2Radiation enhanced bipolar transistorTEXAS INSTRUMENTS INC·Filed 2016·Granted Sep 23, 2025·0 cites·15 claims
- 2832US2013126508A1Extending Radiation Tolerance By Localized Temperature Annealing Of Semiconductor DevicesSALZMAN JAMES FRED·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →